Out-of-plane electromechanical response of monolayer molybdenum disulfide measured by piezoresponse force microscopy CJ Brennan, R Ghosh, K Koul, SK Banerjee, N Lu, ET Yu Nano letters 17 (9), 5464-5471, 2017 | 115 | 2017 |
CHIMERA: A 0.92 TOPS, 2.2 TOPS/W edge AI accelerator with 2 MByte on-chip foundry resistive RAM for efficient training and inference M Giordano, K Prabhu, K Koul, RM Radway, A Gural, R Doshi, ZF Khan, ... 2021 symposium on VLSI circuits, 1-2, 2021 | 52 | 2021 |
CHIMERA: A 0.92-TOPS, 2.2-TOPS/W edge AI accelerator with 2-MByte on-chip foundry resistive RAM for efficient training and inference K Prabhu, A Gural, ZF Khan, RM Radway, M Giordano, K Koul, R Doshi, ... IEEE Journal of Solid-State Circuits 57 (4), 1013-1026, 2022 | 34 | 2022 |
Out-of-plane electromechanical coupling in transition metal dichalcogenides CJ Brennan, K Koul, N Lu, ET Yu Applied Physics Letters 116 (5), 2020 | 31 | 2020 |
Aha: An agile approach to the design of coarse-grained reconfigurable accelerators and compilers K Koul, J Melchert, K Sreedhar, L Truong, G Nyengele, K Zhang, Q Liu, ... ACM Transactions on Embedded Computing Systems 22 (2), 1-34, 2023 | 21* | 2023 |
Amber: A 367 GOPS, 538 GOPS/W 16nm SoC with a coarse-grained reconfigurable array for flexible acceleration of dense linear algebra A Carsello, K Feng, T Kong, K Koul, Q Liu, J Melchert, G Nyengele, ... 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and …, 2022 | 21 | 2022 |
Cascade: An application pipelining toolkit for coarse-grained reconfigurable arrays J Melchert, Y Mei, K Koul, Q Liu, M Horowitz, P Raina IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 2024 | 2 | 2024 |
Amber: Coarse-grained reconfigurable array-based soc for dense linear algebra acceleration K Feng, A Carsello, T Kong, K Koul, Q Liu, J Melchert, G Nyengele, ... 2022 IEEE Hot Chips 34 Symposium (HCS), 1-30, 2022 | 2 | 2022 |
Hardware Abstractions and Hardware Mechanisms to Support Multi-Task Execution on Coarse-Grained Reconfigurable Arrays T Kong, K Koul, P Raina, M Horowitz, C Torng | 2 | 2022 |
Amber: A 16-nm System-on-Chip With a Coarse-Grained Reconfigurable Array for Flexible Acceleration of Dense Linear Algebra K Feng, T Kong, K Koul, J Melchert, A Carsello, Q Liu, G Nyengele, ... IEEE Journal of Solid-State Circuits, 2023 | | 2023 |
(Invited) Strain and Electromechanical Coupling at the Nanoscale in Atomically Thin Transition Metal Dichalcogenides ET Yu, Z Zhang, CJ Brennan, AC De Palma, G Cossio, K Koul Electrochemical Society Meeting Abstracts aimes2018, 706-706, 2018 | | 2018 |