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Benjamin Lyon
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Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective
Y Qin, B Albano, J Spencer, JS Lundh, B Wang, C Buttay, M Tadjer, ...
Journal of physics D: applied physics 56 (9), 093001, 2023
482023
Electro-thermal device-package co-design for ultra-wide bandgap gallium oxide power devices
B Albano, B Wang, Y Zhang, C DiMarino
2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022
42022
(Invited) Considerations and Strategies for High-Temperature Ultra-Wide Bandgap Gallium Oxide Power Modules
C DiMarino, B Albano, B Wang, Y Zhang
Electrochemical Society Meeting Abstracts 241, 1320-1320, 2022
22022
Investigation and Evaluation of High-Temperature Encapsulation Materials for Power Module Applications
B Lyon, C DiMarino
Journal of Microelectronics and Electronic Packaging 20 (3), 89-94, 2023
12023
Electro-Thermal Device-Package Co-Design for a High-Temperature Ultra-Wide-Bandgap Gallium-Oxide Power Module
BP Lyon
Virginia Tech, 2023
2023
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