| Electromigration in 3D-IC scale Cu/Sn/Cu solder joints CE Ho, PT Lee, CN Chen, CH Yang Journal of Alloys and Compounds 676, 361-368, 2016 | 41 | 2016 |
| IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique CE Ho, SP Yang, PT Lee, CY Lee, CC Chen, TT Kuo Journal of Materials Research and Technology 11, 1895-1910, 2021 | 31 | 2021 |
| High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF) PT Lee, CH Chang, CY Lee, YS Wu, CH Yang, CE Ho Materials & Design 206, 109830, 2021 | 30 | 2021 |
| High-speed Cu electrodeposition and its solderability PT Lee, YS Wu, PC Lin, CC Chen, WZ Hsieh, CE Ho Surface and Coatings Technology 320, 559-567, 2017 | 26 | 2017 |
| Self-annealing behavior of electroplated Cu with different brightener concentrations CH Yang, YW Lee, CY Lee, PT Lee, CE Ho Journal of The Electrochemical Society 167 (8), 082514, 2020 | 23 | 2020 |
| High-temperature stability of Au/Pd/Cu and Au/Pd (P)/Cu surface finishes CE Ho, WZ Hsieh, PT Lee, YH Huang, TT Kuo Applied surface science 434, 1353-1360, 2018 | 20 | 2018 |
| Real-time X-ray microscopy study of electromigration in microelectronic solder joints CE Ho, CH Yang, PT Lee, CT Chen Scripta Materialia 114, 79-83, 2016 | 20 | 2016 |
| TEM investigation of interfacial microstructure and fracture mode of the Sn-Ag-Cu/Ni joint system CE Ho, MK Lu, PT Lee, YH Huang, WL Chou Materials Science and Engineering: A 706, 269-278, 2017 | 19 | 2017 |
| Effect of Pd (P) thickness on the soldering reaction between Sn–3Ag–0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad CE Ho, LH Hsu, CH Yang, TC Yeh, PT Lee Thin Solid Films 584, 257-264, 2015 | 17 | 2015 |
| High-speed Cu electrodeposition and reliability of Cu pillar bumps in high-temperature storage PT Lee, YS Wu, CY Lee, HC Liu, CE Ho Journal of the electrochemical society 165 (13), D647, 2018 | 14 | 2018 |
| Interfacial microstructure and mechanical reliability of the Sn-Ag-Cu/Au/Pd (xP)/Ni (P) reactive system: P content effects YS Wu, PT Lee, YH Huang, TT Kuo, CE Ho Surface and Coatings Technology 350, 874-879, 2018 | 13 | 2018 |
| Comparative study between Au/Pd/Cu and Au/Pd (P)/Cu films in soldering applications PT Lee, WZ Hsieh, TC Yeh, HK Wang, CE Ho Surface and Coatings Technology 303, 103-111, 2016 | 12 | 2016 |
| Artifact-free microstructures of the Cu–In reaction by using cryogenic broad argon beam ion polishing HT Hung, PT Lee, CH Tsai, CR Kao Journal of Materials Research and Technology 9 (6), 12946-12954, 2020 | 11 | 2020 |
| Significant improvement of the thermal stability and electrochemical corrosion resistance of the Au/Pd surface finish through catalytic modification YH Huang, SP Yang, PT Lee, TT Kuo, CE Ho Corrosion Science 146, 112-120, 2019 | 11 | 2019 |
| Interfacial reaction and mechanical reliability between Sn-3Ag-0.5 Cu alloy and ultrathin-Ni (P)-type Au/Pd (P)/Ni (P)/Cu metallization pad YS Wu, PT Lee, WZ Hsieh, TT Kuo, CE Ho Surface and Coatings Technology 359, 374-383, 2019 | 10 | 2019 |
| Reaction of Au/Pd/Cu and Au/Pd/Au/Cu multilayers with Sn-Ag-Cu alloy YH Huang, WZ Hsieh, PT Lee, YS Wu, TT Kuo, CE Ho Surface and Coatings Technology 358, 753-761, 2019 | 10 | 2019 |
| Real-time study of electromigration in Sn Blech structure CE Ho, WZ Hsieh, CH Yang, PT Lee Applied Surface Science 388, 339-344, 2016 | 10 | 2016 |
| TEM characterization of Cu self-annealing and direct proof of pinhole formation mechanism in a Cu film CE Ho, CC Chen, CH Yang, PT Lee, WZ Hsieh, YS Wu Surface and Coatings Technology 350, 1010-1019, 2018 | 9 | 2018 |
| Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure PT Lee, WZ Hsieh, CY Lee, SC Tseng, MT Tang, CY Chiang, CR Kao, ... Scripta Materialia 214, 114682, 2022 | 8 | 2022 |
| Synchrotron white Laue nanodiffraction study on the allotropic phase transformation between hexagonal and monoclinic Cu6Sn5 PT Lee, WZ Hsieh, CY Lee, YH Huang, CY Chiang, CS Ku, CR Kao, ... Journal of Materials Research and Technology 13, 1316-1322, 2021 | 8 | 2021 |
Cheng-En HoProfessor in Department of Chemical Engineering & Materials Science, Yuan Ze University.在 saturn.yzu.edu.tw 的电子邮件经过验证
