| Review of packaging schemes for power module F Hou, W Wang, L Cao, J Li, M Su, T Lin, G Zhang, B Ferreira IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 223-238, 2019 | 123 | 2019 |
| Experimental verification and optimization analysis of warpage for panel-level fan-out package F Hou, T Lin, L Cao, F Liu, J Li, X Fan, GQ Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 53 | 2017 |
| Fan-out panel-level PCB-embedded SiC power MOSFETs packaging F Hou, W Wang, R Ma, Y Li, Z Han, M Su, J Li, Z Yu, Y Song, Q Wang, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 367-380, 2019 | 35 | 2019 |
| Thermal analysis of LED lighting system with different fin heat sinks F Hou, D Yang, G Zhang Journal of Semiconductors 32 (1), 014006, 2011 | 30 | 2011 |
| Characterization of PCB embedded package materials for SiC MOSFETs F Hou, W Wang, T Lin, L Cao, GQ Zhang, JA Ferreira IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (6 …, 2019 | 27 | 2019 |
| Microchannel Thermal Management System With Two-Phase Flow for Power Electronics Over 500 W/cm2 Heat Dissipation F Hou, H Zhang, D Huang, J Fan, F Liu, T Lin, L Cao, X Fan, B Ferreira, ... IEEE transactions on power electronics 35 (10), 10592-10600, 2020 | 26 | 2020 |
| Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages F Hou, W Wang, H Zhang, C Chen, C Chen, T Lin, L Cao, GQ Zhang, ... Applied Thermal Engineering 163, 114338, 2019 | 26 | 2019 |
| High power-density 3D integrated power supply module based on panel-level PCB embedded technology F Hou, X Guo, Q Wang, W Wang, T Lin, L Cao, GQ Zhang, JA Ferreira 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1365-1370, 2018 | 23 | 2018 |
| Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate C Chen, F Hou, F Liu, Q She, L Cao, L Wan Microelectronics Reliability 79, 38-47, 2017 | 21 | 2017 |
| Design, integration and performance analysis of a lid-integral microchannel cooling module for high-power chip C Chen, F Hou, R Ma, M Su, J Li, L Cao Applied Thermal Engineering 198, 117457, 2021 | 18 | 2021 |
| Design of a fan-out panel-level SiC MOSFET power module using ant colony optimization-back propagation neural network Y Qian, F Hou, J Fan, Q Lv, X Fan, G Zhang IEEE Transactions on Electron Devices 68 (7), 3460-3467, 2021 | 18 | 2021 |
| Experimental and numerical study of 3D stacked dies under forced air cooling and water immersion cooling D Qiu, L Cao, Q Wang, F Hou, X Wang Microelectronics Reliability 74, 34-43, 2017 | 18 | 2017 |
| Thermal transient analysis of LED array system with in-line pin fin heat sink F Hou, D Yang, GQ Zhang, Y Hai, D Liu, L Liu 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and …, 2011 | 18 | 2011 |
| Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test H Tang, DG Yang, GQ Zhang, F Hou, M Cai, Z Cui 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 16 | 2012 |
| Heat dissipation solution for advanced chip packages F Hou, T Lin US Patent 9,653,378, 2017 | 15 | 2017 |
| Research on heat dissipation of high heat flux multi-chip GaN-based white LED lamp F Hou, D Yang, GQ Zhang, D Liu 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 14 | 2011 |
| Warpage simulation and experiment for panel level fan-out package T Lin, F Hou, H Liu, D Pan, F Chen, J Li, H Zhang, L Cao 2016 IEEE CPMT Symposium Japan (ICSJ), 129-131, 2016 | 13 | 2016 |
| Thermo-mechanical reliability study for 3D package module based on flexible substrate F Hou, X Zhang, X Guo, H Xie, Y Lu, L Cao, L Wan 2013 14th International Conference on Electronic Packaging Technology, 1296-1300, 2013 | 13 | 2013 |
| Evaluation and optimization of a cross-rib micro-channel heat sink H Chen, C Chen, Y Zhou, C Yang, G Song, F Hou, B Jiao, R Liu Micromachines 13 (1), 132, 2022 | 12 | 2022 |
| Design and implementation of a compact 3-D stacked RF front-end module for micro base station G Tian, J Li, F Hou, W Zhang, X Guo, L Cao, L Wan IEEE Transactions on Components, Packaging and Manufacturing Technology 8 …, 2018 | 12 | 2018 |
Guo Qi ZhangProfessor, delft university of technology在 tudelft.nl 的电子邮件经过验证
