| In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper H Ma, A Kunwar, J Sun, B Guo, H Ma Scripta Materialia 107, 88-91, 2015 | 46 | 2015 |
| A data-driven framework to predict the morphology of interfacial Cu6Sn5 IMC in SAC/Cu system during laser soldering A Kunwar, L An, J Liu, S Shang, P Råback, H Ma, X Song Journal of Materials Science & Technology 50, 115-127, 2020 | 42 | 2020 |
| Synthesis of Cu@ Ag core–shell nanoparticles for characterization of thermal stability and electric resistivity S Shang, A Kunwar, Y Wang, X Qi, H Ma, Y Wang Applied Physics A 124, 1-8, 2018 | 40 | 2018 |
| Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints B Guo, A Kunwar, N Zhao, J Chen, Y Wang, H Ma Materials research bulletin 99, 239-248, 2018 | 40 | 2018 |
| Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetallic compounds in Sn/Cu and Sn-3.5 Ag0. 5/Cu joints A Kunwar, S Shang, P Råback, Y Wang, J Givernaud, J Chen, H Ma, ... Microelectronics Reliability 80, 55-67, 2018 | 40 | 2018 |
| In situ study on growth behavior of interfacial bubbles and its effect on interfacial reaction during a soldering process L Qu, HT Ma, HJ Zhao, A Kunwar, N Zhao Applied surface science 305, 133-138, 2014 | 39 | 2014 |
| Combining multi-phase field simulation with neural network analysis to unravel thermomigration accelerated growth behavior of Cu6Sn5 IMC at cold side Cu–Sn interface A Kunwar, J Hektor, S Nomoto, YA Coutinho, N Moelans International Journal of Mechanical Sciences 184, 105843, 2020 | 36 | 2020 |
| 3D printed biomedical devices and their applications: A review on state-of-the-art technologies, existing challenges, and future perspectives HB Mamo, M Adamiak, A Kunwar Journal of the mechanical behavior of biomedical materials 143, 105930, 2023 | 34 | 2023 |
| Integration of machine learning with phase field method to model the electromigration induced Cu6Sn5 IMC growth at anode side Cu/Sn interface A Kunwar, YA Coutinho, J Hektor, H Ma, N Moelans Journal of Materials Science & Technology 59, 203-219, 2020 | 30 | 2020 |
| On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient A Kunwar, H Ma, H Ma, J Sun, N Zhao, M Huang Materials Letters 172, 211-215, 2016 | 30 | 2016 |
| Fabrication of cerium myristate coating for a mechanochemically robust modifier-free superwettability system to enhance the corrosion resistance on 316L steel by one-step … MM Hussain, H Ma, M Huang, Z Gao, J Cao, C Wang, C Dong, Y Wang, ... Surface and Coatings Technology 398, 125970, 2020 | 28 | 2020 |
| Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows HR Ma, A Kunwar, SY Shang, CR Jiang, YP Wang, HT Ma, N Zhao Intermetallics 96, 1-12, 2018 | 26 | 2018 |
| A study on the physical properties and interfacial reactions with Cu substrate of rapidly solidified Sn-3.5 Ag lead-free solder HT Ma, J Wang, L Qu, N Zhao, A Kunwar Journal of electronic materials 42, 2686-2695, 2013 | 26 | 2013 |
| Roles of interfacial heat transfer and relative solder height on segregated growth behavior of intermetallic compounds in Sn/Cu joints during furnace cooling A Kunwar, B Guo, S Shang, P Råback, Y Wang, J Chen, H Ma, X Song, ... Intermetallics 93, 186-196, 2018 | 22 | 2018 |
| Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles during multiple reflows H Ma, A Kunwar, R Huang, J Chen, Y Wang, N Zhao, H Ma Intermetallics 90, 90-96, 2017 | 22 | 2017 |
| Enhancement of hardness of bulk solder by doping Cu nanoparticles at the interface of Sn/Cu solder joint S Shang, Y Wang, Y Wang, H Ma, A Kunwar Microelectronic Engineering 208, 47-53, 2019 | 18 | 2019 |
| Synchrotron radiation imaging study on the rapid IMC growth of Sn–xAg solders with Cu and Ni substrates during the heat preservation stage B Guo, A Kunwar, C Jiang, N Zhao, J Sun, J Chen, Y Wang, M Huang, ... Journal of Materials Science: Materials in Electronics 29, 589-601, 2018 | 18 | 2018 |
| On the thickness of Cu6Sn5 compound at the anode of Cu/liquid Sn/Cu joints undergoing electromigration A Kunwar, H Ma, H Ma, B Guo, Z Meng, N Zhao, M Huang Journal of Materials Science: Materials in Electronics 27, 7699-7706, 2016 | 18 | 2016 |
| Size effect on interface reaction of Sn–xCu/Cu solder joints during multiple reflows R Huang, H Ma, S Shang, A Kunwar, Y Wang, H Ma Journal of Materials Science: Materials in Electronics 30, 4359-4369, 2019 | 16 | 2019 |
| Formation mechanism and kinetic analysis of the morphology of Cu6Sn5 in the spherical solder joints at the Sn/Cu liquid–solid interface during soldering cooling … B Guo, H Ma, C Jiang, Y Wang, A Kunwar, N Zhao, M Huang Journal of Materials Science: Materials in Electronics 28, 5398-5406, 2017 | 15 | 2017 |
Shengyan ShangPh D student, Dalian University of Technology在 mail.dlut.edu.cn 的电子邮件经过验证
