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Hayeol Kim
Hayeol Kim
在 unist.ac.kr 的电子邮件经过验证
标题
引用次数
引用次数
年份
High strength aluminum alloys design via explainable artificial intelligence
S Park, SH Kayani, K Euh, E Seo, H Kim, S Park, BN Yadav, SJ Park, ...
Journal of Alloys and Compounds 903, 163828, 2022
282022
Meniscus‐Guided Micro‐Printing of Prussian Blue for Smart Electrochromic Display
JH Kim, S Park, J Ahn, J Pyo, H Kim, N Kim, ID Jung, SK Seol
Advanced Science 10 (3), 2205588, 2023
172023
Advanced thermal fluid leakage detection system with machine learning algorithm for pipe-in-pipe structure
H Kim, J Lee, T Kim, SJ Park, H Kim
Case Studies in Thermal Engineering 42, 102747, 2023
142023
Transfer learning-based ensemble convolutional neural network for accelerated diagnosis of foot fractures
T Kim, TS Goh, JS Lee, JH Lee, H Kim, ID Jung
Physical and Engineering Sciences in Medicine 46 (1), 265-277, 2023
52023
Laser powder bed fusion for AI assisted digital metal components
E Seo, H Sung, H Jeon, H Kim, T Kim, S Park, MS Lee, SK Moon, JG Kim, ...
Virtual and Physical Prototyping 17 (4), 806-820, 2022
32022
Selective laser melting process for sensor embedding into SUS316L with heat dissipative inner cavity design
MS Lee, H Kim, YT Koo, JH Yu, H Chung, N Kim, H Sung, ID Jung
Metals and Materials International, 1-9, 2022
32022
Meniscus‐Guided Micro‐Printing of Prussian Blue for Smart Electrochromic Display (Adv. Sci. 3/2023)
JH Kim, S Park, J Ahn, J Pyo, H Kim, N Kim, ID Jung, SK Seol
Advanced Science 10 (3), 2370017, 2023
12023
Sensor Embedded Additive Manufacturing for Hyper-Connected Mechanical Components
E Seo, H Kim, S Park, JG Kim, H Sung, ID Jung
Korean Society of Mechanical Engineers, 2023
2023
레이저 파우더 베드 퓨전 방식을 활용한 센서 내장형 적층 제조
서은혁, 김하열, 박상은, 김정기, 성효경, 정임두
대한기계학회 춘추학술대회, 11-11, 2023
2023
메니스커스 기반 마이크로 프린팅을 이용한 프러시안 블루 증강현실 콘택트 렌즈
박서빈, 김하열, 정임두
대한기계학회 춘추학술대회, 13-13, 2023
2023
AI Augmented Digital Metal Component
E Seo, H Sung, H Kim, T Kim, S Park, MS Lee, SK Moon, JG Kim, ...
arXiv preprint arXiv:2201.06735, 2022
2022
Correction to: Selective Laser Melting Process for Sensor Embedding into SUS316L with Heat Dissipative Inner Cavity Design
MS Lee, H Kim, YT Koo, JH Yu, H Chung, N Kim, H Sung, ID Jung
Metals and Materials International 28 (1), 306-306, 2022
2022
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