Method for producing interconnect structures for integrated circuits C Huyghebaert, J Vaes, J Van Olmen US Patent 8,252,659, 2012 | 454 | 2012 |
Solvents and supporting electrolytes in the electrocatalytic reduction of CO2 M König, J Vaes, E Klemm, D Pant iscience 19, 135-160, 2019 | 281 | 2019 |
3D integration by Cu-Cu thermo-compression bonding of extremely thinned bulk-Si die containing 10 μm pitch through-Si vias B Swinnen, W Ruythooren, P De Moor, L Bogaerts, L Carbonell, ... 2006 international electron devices meeting, 1-4, 2006 | 264 | 2006 |
Recent advances in industrial CO2 electroreduction OG Sánchez, YY Birdja, M Bulut, J Vaes, T Breugelmans, D Pant Current Opinion in Green and Sustainable Chemistry 16, 47-56, 2019 | 212 | 2019 |
3D stacked IC demonstration using a through silicon via first approach J Van Olmen, A Mercha, G Katti, C Huyghebaert, J Van Aelst, E Seppala, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 181 | 2008 |
Towards highly efficient electrochemical CO2 reduction: Cell designs, membranes and electrocatalysts RA Tufa, D Chanda, M Ma, D Aili, TB Demissie, J Vaes, Q Li, S Liu, D Pant Applied Energy 277, 115557, 2020 | 133 | 2020 |
Copper plating for 3D interconnects A Radisic, O Lühn, HGG Philipsen, Z El-Mekki, M Honore, S Rodet, ... Microelectronic Engineering 88 (5), 701-704, 2011 | 99 | 2011 |
Crystalline thin‐foil silicon solar cells: where crystalline quality meets thin‐film processing F Dross, K Baert, T Bearda, J Deckers, V Depauw, O El Daif, I Gordon, ... Progress in Photovoltaics: Research and Applications 20 (6), 770-784, 2012 | 97 | 2012 |
Electroreduction of carbon dioxide into formate: A comprehensive review SA Al‐Tamreh, MH Ibrahim, MH El‐Naas, J Vaes, D Pant, A Benamor, ... ChemElectroChem 8 (17), 3207-3220, 2021 | 86 | 2021 |
Integration challenges of copper through silicon via (TSV) metallization for 3D-stacked IC integration J Van Olmen, C Huyghebaert, J Coenen, J Van Aelst, E Sleeckx, ... Microelectronic Engineering 88 (5), 745-748, 2011 | 83 | 2011 |
The role of metal hydroxides in NiFe deposition J Vaes, J Fransaer, JP Celis Journal of the Electrochemical Society 147 (10), 3718, 2000 | 82 | 2000 |
Three novel ways of making thin-film crystalline-silicon layers on glass for solar cell applications I Gordon, F Dross, V Depauw, A Masolin, Y Qiu, J Vaes, D Van Gestel, ... Solar Energy Materials and Solar Cells 95, S2-S7, 2011 | 73 | 2011 |
Epoxy-induced spalling of silicon R Martini, M Gonzalez, F Dross, A Masolin, J Vaes, D Frederickx, ... Energy Procedia 27, 567-572, 2012 | 42 | 2012 |
Highly reliable CMOS-integrated 11MPixel SiGe-based micro-mirror arrays for high-end industrial applications L Haspeslagh, J De Coster, OV Pedreira, I De Wolf, B Du Bois, A Verbist, ... 2008 IEEE International Electron Devices Meeting, 1-4, 2008 | 39 | 2008 |
Integration of aprotic CO 2 reduction to oxalate at a Pb catalyst into a GDE flow cell configuration M König, SH Lin, J Vaes, D Pant, E Klemm Faraday Discussions 230, 360-374, 2021 | 33 | 2021 |
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurries. Part II: Effects of sorbate on chemical mechanical planarization performance M Nagar, J Vaes, Y Ein-Eli Electrochimica Acta 55 (8), 2810-2816, 2010 | 28 | 2010 |
Electrochemical Conversion of CO2 from Direct Air Capture Solutions O Gutierrez-Sanchez, B De Mot, N Daems, M Bulut, J Vaes, D Pant, ... Energy & Fuels 36 (21), 13115-13123, 2022 | 22 | 2022 |
Cathodic inhibition effects during NiFe and ZnNi alloy deposition J Vaes, J Fransaer, JP Celis Journal of the Electrochemical Society 149 (11), C567, 2002 | 21 | 2002 |
Potassium sorbate as an inhibitor in copper chemical mechanical planarization slurry. Part I. Elucidating slurry chemistry M Nagar, D Starosvetsky, J Vaes, Y Ein-Eli Electrochimica acta 55 (10), 3560-3571, 2010 | 20 | 2010 |
CMOS-integrated poly-SiGe cantilevers with read/write system for probe storage device S Severi, J Heck, TKA Chou, N Belov, JS Park, D Harrar, A Jain, ... TRANSDUCERS 2009-2009 International Solid-State Sensors, Actuators and …, 2009 | 20 | 2009 |