| Review of THz-based semiconductor assurance J True, C Xi, N Jessurun, K Ahi, N Asadizanjani Optical Engineering 60 (6), 060901-060901, 2021 | 32 | 2021 |
| Secure interposer-based heterogeneous integration MSM Khan, C Xi, AA Khan, MT Rahman, MM Tehranipoor, ... IEEE Design & Test 39 (6), 156-164, 2022 | 21 | 2022 |
| A framework to assess the security of advanced integrated circuit (ic) packaging C Xi, N Jessurun, N Asadizanjani 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC), 1-7, 2020 | 12 | 2020 |
| Terahertz based machine learning approach to integrated circuit assurance J True, C Xi, N Jessurun, K Ahi, M Tehranipoor, N Asadizanjani 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2235-2245, 2021 | 11 | 2021 |
| Exploring advanced packaging technologies for reverse engineering a system-in-package (sip) MSM Khan, C Xi, MSU Haque, MM Tehranipoor, N Asadizanjani IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 10 | 2023 |
| Scanning acoustic microscopy package fingerprint extraction for integrated circuit hardware assurance D Johnson, PW Hsu, C Xi, N Asadizanjani ISTFA 2021, 59-64, 2021 | 7 | 2021 |
| Physical assurance for heterogeneous integration: Challenges and opportunities C Xi, AA Khan, N Jessurun, N Vashisthan, MM Tehranipoor, ... 2022 IEEE International Symposium on the Physical and Failure Analysis of …, 2022 | 6 | 2022 |
| Machine learning assisted counterfeit ic detection through non-destructive infrared (ir) spectroscopy material characterization C Xi, N Jessurun, J True, AA Khan, MM Tehranipoor, N Asadizanjani 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2249-2255, 2022 | 6 | 2022 |
| Security challenges of MEMS devices in HI packaging AA Khan, K Sahebkar, C Xi, MM Tehranipoor, RF Need, N Asadizanjani 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2321-2327, 2022 | 4 | 2022 |
| Electron Beam Probing: The New Sheriff in Town for Security Analyzing of Sub-7nm ICs-Exploring the Advantages of a Post-Photon Emission Technique N Varshney, C Xi, AA Khan, LK Biswas, V Sorger, H Dalir, N Asadizanjani ISTFA 2023, 346-351, 2023 | 2 | 2023 |
| Digital twin aided IC packaging structure analysis for high-quality sample preparation C Xi, AA Khan, J True, N Vashistha, N Jessurun, N Asadizanjani 2021 IEEE International Symposium on the Physical and Failure Analysis of …, 2021 | 2 | 2021 |
| Enhancing counterfeit detection of integrated circuits through machine learning-assisted THz-TDS analysis C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | 1 | 2024 |
| Materials for Electronics Security and Assurance N Asadizanjani, C Xi, MM Tehranipoor Elsevier, 2024 | 1 | 2024 |
| Microelectronic Encapsulant Material Assessment: A Security Point of View C Xi, J Nathan, N Asadizanjani 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC), 157-162, 2021 | 1 | 2021 |
| Evaluating a Multi-modal, Non-destructive Approach Combining a Resonant Cavity System and Infrared Spectroscopy to Detect Counterfeit and Anomalous Integrated Circuits A Nechiyil, C Xi, N Asadizanjani, R Lee, G Chapman IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Photon Emission Modeling and Machine-Learning Assisted Pre-Silicon Optical Side-Channel Simulation H Li, L Lin, N Chang, S Chowdhury, D Mcguire, B Novakovic, K Monta, ... 2024 IEEE International Symposium on Hardware Oriented Security and Trust …, 2024 | | 2024 |
| Printed circuit board obfuscation systems and methods N Asadi-Zanjani, T John, C Xi, A Khan US Patent App. 18/463,988, 2024 | | 2024 |
| THz-TDS for IC packaging material changes detection under real-world conditions C Xi, N Varshney, MSM Khan, H Dalir, N Asadizanjani Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and …, 2024 | | 2024 |
| : An X-Ray Compatibility Metric for Advanced Packages to Facilitate Design-for-Inspection MSM Khan, C Xi, N Varshney, AA Khan, A Serna, H Dalir, V Sorger, ... 2023 IEEE Physical Assurance and Inspection of Electronics (PAINE), 1-7, 2023 | | 2023 |
| Digital twin modeling of ic packaging structure N Asadi-Zanjani, T John, C Xi US Patent App. 18/054,623, 2023 | | 2023 |
