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Tai Sheng Chen
Tai Sheng Chen
在 itri.org.tw 的电子邮件经过验证
标题
引用次数
引用次数
年份
Effect of reactive gases flow ratios on the microstructure and electrical resistivity of Ta–N–O thin films by reactive co-sputtering
CK Chung, TS Chen, NW Chang
Thin Solid Films 519 (15), 5099-5102, 2011
252011
Grain boundary scattering for temperature coefficient of resistance (TCR) behaviour of Ta–Si–N thin films
CK Chung, A Nautiyal, TS Chen, YL Chang
Journal of Physics D: Applied Physics 41 (18), 185404, 2008
212008
Thermal spray coating of Al-Cu-Fe quasicrystals: Dynamic observations and surface properties
H Parsamehr, TS Chen, DS Wang, MS Leu, I Han, Z Xi, AP Tsai, ...
Materialia 8, 100432, 2019
192019
Effect of microstructures on the electrical and optoelectronic properties of nanocrystalline Ta–Si–N thin films by reactive magnetron cosputtering
CK Chung, TS Chen
Scripta materialia 57 (7), 611-614, 2007
182007
Thermal stability of Ta–Si–N nanocomposite thin films at different nitrogen flow ratios
CK Chung, TS Chen, CC Peng, BH Wu
Surface and Coatings Technology 201 (7), 3947-3952, 2006
182006
Oxidation resistance and mechanical property of cosputtered quasi-amorphous Ta–Si–N films under vacuum rapid thermal annealing
CK Chung, TS Chen, NW Chang, SC Chang, MW Liao
Surface and Coatings Technology 205 (5), 1268-1272, 2010
152010
Effect of Si/Ta and nitrogen ratios on the thermal stability of Ta–Si–N thin films
CK Chung, TS Chen
Microelectronic engineering 87 (2), 129-134, 2010
132010
Preparation and nanoscopic plastic deformation of toughened Al-Cu-Fe-based quasicrystal/vanadium multilayered coatings
SY Chang, BJ Chen, YT Hsiao, DS Wang, TS Chen, MS Leu, HJ Lai
Materials Chemistry and Physics 213, 277-284, 2018
122018
Effect of nitrogen flow ratios on the microstructure and properties of Ta–Al–N thin films by reactive cosputtering
CK Chung, TS Chen
Journal of the Electrochemical Society 156 (2), H119, 2008
102008
Annealing effects on microstructure and properties of Ta–Al thin film resistors
CK Chung, YL Chang, TS Chen, PJ Su
Surface and Coatings Technology 201 (7), 4195-4200, 2006
102006
Characterization and patterning of novel high-TCR Ta–Si–N thin films for sensor application
CK Chung, YL Chang, JC Wu, JJ Jhu, TS Chen
Sensors and Actuators A: Physical 156 (2), 323-327, 2009
92009
Stress writing textured graphite conducting wires/patterns in insulating amorphous carbon matrix as interconnects
DS Wang, SY Chang, TS Chen, TH Chou, YC Huang, JB Wu, MS Leu, ...
Scientific Reports 7 (1), 9727, 2017
82017
Effect of the target shuttering on the characteristics of the Ta–Si–N thin films by reactive magnetron co-sputtering
CK Chung, TS Chen, A Nautiyal, NW Chang, ST Hung
Surface and Coatings Technology 204 (6-7), 1071-1075, 2009
82009
Effect of nitrogen flow ratio on the microstructure evolution and nanoindented mechanical property of the Ta–Si–N thin films
CK Chung, TS Chen
Journal of Materials Research 23 (2), 494-499, 2008
82008
Metal/polymer composite material and method for fabricating the same
HJ Lai, MS Leu, TS Chen, WT Hsiao
US Patent 10,195,816, 2019
42019
Synthesis and characteristics of nanostructured silicon-rich nitride thin films using modified long-wavelength CO2 laser annealing
CK Chung, CH Li, TS Chen
Laser Physics Letters 12 (9), 096003, 2015
32015
Effect of annealing temperature on the microstructure and photoluminescence of low resistivity Si/SiN/TaN thin films using magnetron sputtering
CK Chung, TS Chen, NW Chang, MW Liao, CT Lee
Thin solid films 520 (5), 1460-1463, 2011
32011
A new visible photoluminescence in the conducting Ta–Si–N nanocomposite thin films
CK Chung, TS Chen
Journal of luminescence 129 (4), 370-375, 2009
32009
Structure of thermoelectric film
MS Leu, TS Chen, CC Shih
US Patent 9,166,137, 2015
12015
Fabrication and characterization of nanostructured Ta-Si-N films
CK Chung, TS Chen, CC Peng, BH Wu
2007 2nd IEEE International Conference on Nano/Micro Engineered and …, 2007
12007
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