| A lumped thermal model including thermal coupling and thermal boundary conditions for high-power IGBT modules AS Bahman, K Ma, F Blaabjerg IEEE Transactions on Power Electronics 33 (3), 2518-2530, 2017 | 252 | 2017 |
| Complete loss and thermal model of power semiconductors including device rating information K Ma, AS Bahman, S Beczkowski, F Blaabjerg IEEE Transactions on Power Electronics 30 (5), 2556-2569, 2014 | 204 | 2014 |
| A 3-D-lumped thermal network model for long-term load profiles analysis in high-power IGBT modules AS Bahman, K Ma, P Ghimire, F Iannuzzo, F Blaabjerg IEEE Journal of Emerging and Selected Topics in Power Electronics 4 (3 …, 2016 | 175 | 2016 |
| A review on IGBT module failure modes and lifetime testing A Abuelnaga, M Narimani, AS Bahman IEEE access 9, 9643-9663, 2021 | 110 | 2021 |
| Mission-Profile-Based Lifetime Prediction for a SiC mosfet Power Module Using a Multi-Step Condition-Mapping Simulation Strategy L Ceccarelli, RM Kotecha, AS Bahman, F Iannuzzo, HA Mantooth IEEE Transactions on Power Electronics 34 (10), 9698-9708, 2019 | 79 | 2019 |
| Thermal impedance model of high power IGBT modules considering heat coupling effects AS Bahman, K Ma, F Blaabjerg 2014 International Power Electronics and Application Conference and …, 2014 | 75 | 2014 |
| Active Power Cycling Test Bench for SiC Power MOSFET s—Principles, Design, and Implementation S Baba, A Gieraltowski, M Jasinski, F Blaabjerg, AS Bahman, ... IEEE Transactions on Power Electronics 36 (3), 2661-2675, 2020 | 49 | 2020 |
| Optimization tool for direct water cooling system of high power IGBT modules AS Bahman, F Blaabjerg 2016 18th European Conference on Power Electronics and Applications (EPE'16 …, 2016 | 44 | 2016 |
| Mission-profile-based stress analysis of bond-wires in SiC power modules AS Bahman, F Iannuzzo, F Blaabjerg Microelectronics reliability 64, 419-424, 2016 | 38 | 2016 |
| Power electronic converter reliability and prognosis review focusing on power switch module failures A Abuelnaga, M Narimani, AS Bahman Journal of Power Electronics 21 (6), 865-880, 2021 | 36 | 2021 |
| A modification of offset strip fin heatsink with high-performance cooling for IGBT modules A Yahyaee, AS Bahman, F Blaabjerg Applied sciences 10 (3), 1112, 2020 | 36 | 2020 |
| Modeling of short-circuit-related thermal stress in aged IGBT modules AS Bahman, F Iannuzzo, C Uhrenfeldt, F Blaabjerg, S Munk-Nielsen IEEE Transactions on Industry Applications 53 (5), 4788-4795, 2017 | 34 | 2017 |
| A fast electro-thermal co-simulation modeling approach for SiC power MOSFETs L Ceccarelli, AS Bahman, F Iannuzzo, F Blaabjerg 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 966-973, 2017 | 34 | 2017 |
| Compact sandwiched press-pack SiC power module with low stray inductance and balanced thermal stress Y Chang, H Luo, F Iannuzzo, AS Bahman, W Li, X He, F Blaabjerg IEEE Transactions on Power Electronics 35 (3), 2237-2241, 2019 | 32 | 2019 |
| General 3D lumped thermal model with various boundary conditions for high power IGBT modules AS Bahman, K Ma, F Blaabjerg 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 261-268, 2016 | 29 | 2016 |
| Electrical parasitics and thermal modeling for optimized layout design of high power SiC modules AS Bahman, F Blaabjerg, A Dutta, A Mantooth 2016 IEEE Applied Power Electronics Conference and Exposition (APEC), 3012-3019, 2016 | 28 | 2016 |
| Frozen leg operation of a three-phase dual active bridge converter S Haghbin, F Blaabjerg, AS Bahman IEEE Transactions on Power Electronics 34 (5), 4239-4248, 2018 | 27 | 2018 |
| Lifetime analysis of metallized polypropylene capacitors in modular multilevel converter based on finite element method R Yao, H Li, W Lai, AS Bahman, F Iannuzzo IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020 | 26 | 2020 |
| Lifetime estimation and failure risk analysis in a power stage used in wind-fuel cell hybrid energy systems S Rastayesh, S Bahrebar, AS Bahman, JD Sørensen, F Blaabjerg Electronics 8 (12), 1412, 2019 | 23 | 2019 |
| A novel 3D thermal impedance model for high power modules considering multi-layer thermal coupling and different heating/cooling conditions AS Bahman, K Ma, F Blaabjerg 2015 IEEE Applied Power Electronics Conference and Exposition (APEC), 1209-1215, 2015 | 23 | 2015 |
Frede BlaabjergProfessor in Power Electronics, Villum Investigator, Aalborg University, Denmark在 et.aau.dk 的电子邮件经过验证
