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Chenhui Gai
Chenhui Gai
在 stu.hit.edu.cn 的电子邮件经过验证
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年份
Scalable Fabrication of Flexible Single‐Layer Strain and Double‐Layer Pressure Sensors by Inkjet Printing for Subtle Vibration Detection
C Gai, D Li, X Zhang, H Zhang, N Li, X Zheng, D Wu, J Sun
Advanced Materials Interfaces 8 (13), 2100632, 2021
132021
A Comprehensive Review of Surface Acoustic Wave-Enabled Acoustic Droplet Ejection Technology and Its Applications
J Ning, Y Lei, H Hu, C Gai
Micromachines 14 (8), 1543, 2023
82023
Intelligent sensing system of the car seat with flexible piezoresistive sensor of double-layer conductive network
X Bai, C Gai, D Wu, J Zhu, G Wu, M Zhang, Y Liu, J Sun, J Zhuang, ...
IEEE Sensors Journal 22 (4), 3113-3121, 2022
72022
Combination of pulse signal modulation and hydrophilic treatment of a substrate for controlling the thermal distribution in surface acoustic wave atomization
C Gai, H Hu, J Han, Y Lei, J Ning, D Ye
Applied Thermal Engineering 228, 120377, 2023
52023
Optimization analysis of particle separation parameters for a standing surface acoustic wave acoustofluidic chip
J Han, H Hu, Y Lei, Q Huang, C Fu, C Gai, J Ning
ACS omega 8 (1), 311-323, 2022
52022
Secondary embossing method for the capsulation of high-sensitive flexible piezoresistive sensors
X Bai, Y Du, C Gai, Y Guo, Y Liu, Y Huang, H Xu, D Wu, J Sun
Sensors and Actuators A: Physical 335, 113356, 2022
52022
Numerical study of thermocapillary and slip effects on interfacial destabilization under surface acoustic waves
J Ning, QY Huang, CH Gai, YZ Ding, B Zhang, YL Lei, Y Wu, H Hu
Physics of Fluids 36 (7), 2024
22024
Development of Highly Efficient Lamb Wave Transducers toward Dual-Surface Simultaneous Atomization
C Gai, Q Ma, J Ning, Y Ding, Y Lei, H Li, C Guo, H Hu
Sensors 24 (17), 5607, 2024
2024
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