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Zlatan AksamijaAssociate Professor, Materials Science and Engineering, University of Utah在 utah.edu 的电子邮件经过验证- Edwin Bosco RamayyaThermo Mechanical Modeling Group, Intel Corporation在 intel.com 的电子邮件经过验证
- Susan C. HagnessPhilip D Reed Professor of Electrical and Computer Engineering, University of Wisconsin-Madison在 engr.wisc.edu 的电子邮件经过验证
- Dragica VasileskaArizona State University在 asu.edu 的电子邮件经过验证
- D. BotezPhilip Dunham Reed Professor, University of Wisconsin-Madison在 engr.wisc.edu 的电子邮件经过验证
- Song MeiUniversity of Wisconsin Madison在 wisc.edu 的电子邮件经过验证
- Amirhossein DavoodyIntel Inc.在 intel.com 的电子邮件经过验证
- Farhad KarimiMicrosoft Station Q at Santa Barbara在 microsoft.com 的电子邮件经过验证
- Leon N Maurer在 wisc.edu 的电子邮件经过验证
- Mark A. ErikssonJohn Bardeen Professor of Physics, Department of Physics, University of Wisconsin-Madison在 wisc.edu 的电子邮件经过验证
- DONALD SAVAGEUniversity of Wisconsin在 wisc.edu 的电子邮件经过验证
- Paul EvansProfessor, Materials Science and Engineering, University of Wisconsin-Madison在 wisc.edu 的电子邮件经过验证
- Yanbing ShiUniversity of Wisconsin-Madison在 wisc.edu 的电子邮件经过验证
- George K CellerProfessor of Materials Science, Rutgers University在 rci.rutgers.edu 的电子邮件经过验证
- Weina PengUniversity of Texas at Dallas在 utdallas.edu 的电子邮件经过验证
- Benjamin B. YangGeorgia Tech Research Institute在 gatech.edu 的电子邮件经过验证
- Eric PopPease-Ye Professor of Electrical Eng., Materials Sci., App. Phys., Stanford & SLAC在 stanford.edu 的电子邮件经过验证
- LUKE MAWSTUniversity of Wisconsin在 wisc.edu 的电子邮件经过验证
- Feng LiuProfessor, Department of Materials Science and Engineering, University of Utah在 eng.utah.edu 的电子邮件经过验证
- Michael S. ArnoldProfessor of Materials Science and Engineering在 wisc.edu 的电子邮件经过验证
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Irena Knezevic
Professor, Electrical and Computer Engineering, University of Wisconsin - Madison
在 engr.wisc.edu 的电子邮件经过验证 - 首页