| Thermal aging effects on the thermal cycling reliability of lead-free fine pitch packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... IEEE transactions on components, packaging and manufacturing technology 3 (8 …, 2013 | 133 | 2013 |
| Correlation of Aging Effects on Creep Rate and Reliability in Lead Free Solder Joints S J. C. Suhling Jiawei Zhang, Zhou Hai Orlando, F. L. "Journal of Surface Mount Technology." (2012) 25 (3), 19-28, 2012 | 131* | 2012 |
| Thermal cycling reliability of aged PBGA assemblies-comparison of Weibull failure data and finite element model predictions MM Basit, M Motalab, JC Suhling, Z Hai, J Evans, MJ Bozack, P Lall 2015 IEEE 65th electronic components and technology conference (ECTC), 106-117, 2015 | 70 | 2015 |
| Long term aging effects on the reliability of lead free solder joints in ball grid array packages with various pitch sizes and ball alignments C Zhao, C Shen, Z Hai, J Zhang, MJ Bozack, JL Evans SMTA International, 2015 | 68 | 2015 |
| Reliability comparison of aged SAC fine-pitch ball grid array packages versus surface finishes Z Hai, J Zhang, C Shen, JL Evans, MJ Bozack, MM Basit, JC Suhling IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (6 …, 2015 | 65 | 2015 |
| Reliability Degradation of SAC105 and SAC305 BGA Packages Under Long-Term High Temperature Aging Z Hai, J Zhang, C Shen, EK Snipes, JC Suhling, MJ Bozack, JL Evans SMTA Journal 27 (2), 11-18, 2014 | 41 | 2014 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Materials 10 (5), 451, 2017 | 29 | 2017 |
| Reliability Analysis of Lead-Free Solder Joints with Solder Doping on Harsh Environment C Zhao, T Sanders, Z Hai, C Shen, JL Evans International Symposium on Microelectronics 2016 (1), 000117-000122, 2016 | 15 | 2016 |
| Long-term aging effects on reliability performance of lead-free solder joints Z Hai, J Zhang, C Shen, JL Evans, MJ Bozack Proc. Surface Mount Technology International Conference, 362-370, 2013 | 15 | 2013 |
| Aging effects on creep behaviors of lead-free solder joints and reliability of fine-pitch packages J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, Y Zhang, ... proc. Surface Mount Technology International Conference, 2012 | 11 | 2012 |
| Reliability of Lead-Free Electronic Package Interconnections under Harsh Environment Z Hai Auburn University, 2014 | 9 | 2014 |
| Sn-Ag-Cu Solder Joints Interconnection Reliability of BGA Package during Thermal Aging and Cycling C Shen, C Zhao, Z Hai, J Zhang, MJ Bozack, JC Suhling, JL Evans International Symposium on Microelectronics 2015 (1), 000135-000140, 2015 | 6 | 2015 |
| Isothermal Aging Effects on the Harsh Environment Performance of Lead-Free Solder J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack proc. 45th International Symposium on Microelectronics, 000801-000808, 2012 | 6 | 2012 |
| Isothermal Aging Effects on the Thermal Reliability Performance of Lead-Free Solder Joints S John L. Evans Jiawei Zhang, Zhou Hai 45th International Symposium on Microelectronics, 000801-000808, 2012 | 6 | 2012 |
| Effects on the reliability of lead-free solder joints under harsh environment Z Hai, J Zhang, C Shen, C Zhao, JL Evans, MJ Bozack International Symposium on Microelectronics 2014 (1), 000471-000476, 2014 | 5 | 2014 |
| Isothermal aging effects on the harsh environment performance of lead-free solder joints J Zhang, Z Hai, S Thirugnanasambandam, JL Evans, MJ Bozack, R Sesek SMTA International, 2012 | 5 | 2012 |
| Packaging reliability effect of ENIG and ENEPIG surface finishes in board level thermal test under long-term aging and cycling. Materials, 2017, 10 (5): 451-464 CB Shen, Z Hai, C Zhao, JW Zhang, JL Evans, MJ Bozack, JC Suhling ed, 0 | 5 | |
| Reliability performance of lead-free SAC solder joints on ENIG and ENEPIG subject to long-term isothermal aging Z Hai, J Zhang, C Shen, EK Snipes, JC Suhling, MJ Bozack, JL Evans J. Mechatron 2 (10.1166), 2014 | 4 | 2014 |
| Reliability analysis of aging in joint microstructures for Sn-Ag-Cu solder joints during thermal cycling C Shen, Z Hai, C Zhao, J Zhang, MJ Bozack, JC Suhling, JL Evans International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 3 | 2015 |
| Reliability Study and Failure Analysis for Surface Finishes on Sn–Ag–Cu Solder Joints During Thermal Cycling C Shen, Z Hai, C Zhao, J Zhang, JL Evans, MJ Bozack, JC Suhling Journal of Mechatronics 3 (4), 269-275, 2016 | 1 | 2016 |
Jiawei ZhangAuburn University在 tigermail.auburn.edu 的电子邮件经过验证
