| Bonded structures with integrated passive component B Haba, I Mohammed, R Katkar, GZ Guevara, JA Delacruz, S Huang, ... US Patent 11,626,363, 2023 | 124 | 2023 |
| Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics G Gao, GG Fountain Jr, LW Mirkarimi, R Katkar, I Mohammed, CE Uzoh US Patent 11,011,494, 2021 | 124 | 2021 |
| Multichip modules and methods of fabrication L Wang, R Katkar, H Shen US Patent 9,666,559, 2017 | 119 | 2017 |
| Bonded structures PM Enquist, L Wang, R Katkar, JA Delacruz, AR Sitaram US Patent 10,522,499, 2019 | 118 | 2019 |
| Large metal pads over TSV G Gao, LEE Bongsub, GG Fountain Jr, CE Uzoh, LW Mirkarimi, B Haba, ... US Patent 11,393,779, 2022 | 117 | 2022 |
| Bonded structures L Wang, R Katkar, JA Delacruz, AR Sitaram US Patent 10,002,844, 2018 | 112 | 2018 |
| Image sensor device R Katkar US Patent 9,899,442, 2018 | 112 | 2018 |
| Direct-bonded lamination for improved image clarity in optical devices B Haba, R Katkar, I Mohammed US Patent 11,256,004, 2022 | 110 | 2022 |
| Cavity packages S Huang, JA Delacruz, L Wang, R Katkar, B Haba US Patent 10,923,408, 2021 | 110 | 2021 |
| Bonded structures R Katkar, L Wang US Patent 11,380,597, 2022 | 108 | 2022 |
| Protective elements for bonded structures JA Delacruz, B Haba, R Katkar US Patent 11,373,963, 2022 | 107 | 2022 |
| Bonded structures R Katkar, LW Mirkarimi, LEE Bongsub, GG Fountain Jr, CE Uzoh US Patent 11,004,757, 2021 | 107 | 2021 |
| Integrated circuit assemblies with reinforcement frames, and methods of manufacture R Katkar, LW Mirkarimi, A Sitaram, CG Woychik US Patent 9,355,997, 2016 | 106 | 2016 |
| Making electrical components in handle wafers of integrated circuit packages L Wang, H Shen, R Katkar US Patent 9,165,793, 2015 | 105 | 2015 |
| Wafer-level bonding of obstructive elements JA Delacruz, R Katkar US Patent 11,205,625, 2021 | 104 | 2021 |
| Bonded structures without intervening adhesive B Haba, R Katkar, I Mohammed, JA Delacruz US Patent 11,476,213, 2022 | 103 | 2022 |
| Seal for microelectronic assembly R Katkar, L Wang, CE Uzoh, S Huang, G Gao, I Mohammed US Patent 10,508,030, 2019 | 102 | 2019 |
| Protective elements for bonded structures including an obstructive element B Haba, JA Delacruz, R Katkar, A Sitaram US Patent 11,610,846, 2023 | 101 | 2023 |
| Direct-bonded optoelectronic interconnect for high-density integrated photonics L Wang, R Katkar US Patent 11,011,503, 2021 | 97 | 2021 |
| Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects CE Uzoh, R Katkar US Patent 9,379,074, 2016 | 97 | 2016 |
Belgacem HabaAdeia, Google, Tessera, SiPipe, Rambus, NEC, IBM, Stanford University, USTHB在 alumni.stanford.edu 的电子邮件经过验证
