| Fabrication of Fe3O4 coated boron nitride nanoplatelets by liquid-phase exfoliation for thermally enhanced epoxy composites via magnetic alignment Y Kim, J Kim Composites Science and Technology 188, 107961, 2020 | 54 | 2020 |
| The thermal properties of a UV curable acrylate composite prepared by digital light processing 3D printing S Lee, Y Kim, D Park, J Kim Composites Communications 26, 100796, 2021 | 39 | 2021 |
| Enhanced thermal conductivity of epoxy composites using boron nitride nanoplatelets prepared by Fe3O4 assisted liquid-phase exfoliation Y Kim, H Oh, J Kim Ceramics International 45 (18), 24121-24126, 2019 | 29 | 2019 |
| Tailoring of Si–C–N–O ceramic-coated reduced graphene oxide by oil/water-solution process for high thermal conductive epoxy composite with electrical insulation H Oh, Y Kim, J Wie, K Kim, J Kim Composites Science and Technology 197, 108257, 2020 | 27 | 2020 |
| Carbonization of polydopamine-coating layers on boron nitride for thermal conductivity enhancement in hybrid polyvinyl alcohol (PVA) composites Y Kim, J Kim Polymers 12 (6), 1410, 2020 | 26 | 2020 |
| Selectively distributed graphene in 1, 6-hexanediol diacrylate/epoxy composites via digital light processing 3D printing for enhanced thermal conductivity D Park, Y Kim, S Lee, J Kim Synthetic Metals 276, 116763, 2021 | 24 | 2021 |
| Co-curable poly (glycidyl methacrylate)-grafted graphene/epoxy composite for thermal conductivity enhancement H Oh, Y Kim, J Kim Polymer 183, 121834, 2019 | 23 | 2019 |
| Enhanced cathodic catalytic activity of an N-doped micropore structure obtained through the six-coordinate bond of an EDTA-Ce composite for the oxygen reduction reaction K Kim, Y Kim, J Kim Applied Surface Science 505, 144418, 2020 | 13 | 2020 |
| Electrically conductive poly (methyl methacrylate)-reduced graphene oxide/poly (styrene-co-acrylonitrile) composite with double percolative architecture H Oh, Y Kim, J Kim Organic Electronics 85, 105877, 2020 | 10 | 2020 |
| p-GaN/n-IGZO self-powered ultraviolet photodetector with ultralow dark current and high sensitivity Y Liao, YJ Kim, M Kim Chemical Engineering Journal 476, 146838, 2023 | 7 | 2023 |
| 3D Interconnected Boron Nitride Networks in Epoxy Composites via Coalescence Behavior of SAC305 Solder Alloy as a Bridging Material for Enhanced Thermal Conductivity Y Kim, J Kim Polymers 12 (9), 1954, 2020 | 6 | 2020 |
| Antireflective GaN Nanoridge Texturing by Metal-Assisted Chemical Etching via a Thermally Dewetted Pt Catalyst Network for Highly Responsive Ultraviolet Photodiodes Y Liao, YJ Kim, J Lai, JH Seo, M Kim ACS Applied Materials & Interfaces 15 (10), 13343-13352, 2023 | 5 | 2023 |
| Flexible TiN/Ge photodetectors with enhanced responsivity via localized surface plasmon resonance and strain modulation YJ Kim, S An, Y Liao, PR Huang, B Son, CS Tan, GE Chang, M Kim Journal of Materials Chemistry C 11 (13), 4520-4525, 2023 | 4 | 2023 |
| A strategy for low thermal conductivity and enhanced thermoelectric power factor in one-dimensional Bi2Te3/Cu2Te nanowire composites D Park, H Ju, Y Kim, J Kim Journal of Materials Science: Materials in Electronics 30, 13297-13304, 2019 | 4 | 2019 |
| Enhanced Thermal Conductivity of Epoxy Composites Filled with Cu Foam and Functionalized with MWCNT 3D Network Y Kim, S Lee, J Kim 폴리머 45 (1), 56-61, 2021 | 3 | 2021 |
| Self-powered silicon metal–semiconductor–metal photodetector based on asymmetric Schottky barrier heights YJ Kim, MR Kumar, GM Kumar, M Kim Applied Physics Letters 123 (25), 2023 | 1 | 2023 |
| Plasma-free metal-assisted chemical etching producing three-dimensional gallium nitride structures Y Liao, YJ Kim, S An, M Kim Journal of Materials Chemistry C 11 (40), 13707-13713, 2023 | | 2023 |
| Sustainable manufacturing process for wafer-scale uniform semiconductor nanostructures YJ Kim, SH Shin, ZJ Zhao, JH Jeong, M Kim 2022 IEEE 22nd International Conference on Nanotechnology (NANO), 435-438, 2022 | | 2022 |
Jooheon KimChung-Ang University在 cau.ac.kr 的电子邮件经过验证
Jooheon KimChung-Ang University在 cau.ac.kr 的电子邮件经过验证
Munho KimAssistant Professor of EEE at Nanyang Technological University在 ntu.edu.sg 的电子邮件经过验证