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Ming-Yi Tsai
Ming-Yi Tsai
在 mail.cgu.edu.tw 的电子邮件经过验证
标题
引用次数
引用次数
年份
Improved theoretical solutions for adhesive lap joints
MY Tsai, DW Oplinger, J Morton
International Journal of Solids and structures 35 (12), 1163-1185, 1998
5101998
An evaluation of analytical and numerical solutions to the single-lap joint
MY Tsai, J Morton
International Journal of Solids and Structures 31 (18), 2537-2563, 1994
2941994
The effect of a spew fillet on adhesive stress distributions in laminated composite single-lap joints
MY Tsai, J Morton
Composite structures 32 (1-4), 123-131, 1995
2791995
An evaluation of the Iosipescu specimen for composite materials shear property measurement
J Morton, H Ho, MY Tsai, GL Farley
Journal of Composite Materials 26 (5), 708-750, 1992
1491992
Investigation of thermomechanical behaviors of flip chip BGA packages during manufacturing process and thermal cycling
MY Tsai, CHJ Hsu, CTO Wang
IEEE Transactions on Components and Packaging Technologies 27 (3), 568-576, 2004
1312004
A note on Suhir’s solution of thermal stresses for a die-substrate assembly
MY Tsai, CH Hsu, CN Han
J. Electron. Packag. 126 (1), 115-119, 2004
1102004
Experimental and numerical studies of a laminated composite single-lap adhesive joint
MY Tsai, J Morton, FL Matthews
Journal of Composite Materials 29 (9), 1254-1275, 1995
1051995
An investigation into the stresses in double-lap adhesive joints with laminated composite adherends
MY Tsai, J Morton
International Journal of Solids and Structures 47 (24), 3317-3325, 2010
1032010
Thermal measurements and analyses of low-cost high-power LED packages and their modules
MY Tsai, CH Chen, CS Kang
Microelectronics Reliability 52 (5), 845-854, 2012
992012
Warpage analysis of flip-chip PBGA packages subject to thermal loading
MY Tsai, HY Chang, M Pecht
IEEE Transactions on Device and Materials Reliability 9 (3), 419-424, 2009
822009
Three-dimensional deformations in a single-lap joint
MY Tsai, J Morton
The Journal of Strain Analysis for Engineering Design 29 (2), 137-145, 1994
821994
An experimental investigation of nonlinear deformations in single-lap joints
MY Tsai, J Morton
Mechanics of materials 20 (3), 183-194, 1995
771995
Numerical analysis of the Iosipescu specimen for composite materials
H Ho, MY Tsai, J Morton, GL Farley
Composites science and technology 46 (2), 115-128, 1993
731993
The effect of epoxy molding compound on thermal/residual deformations and stresses in IC packages during manufacturing process
MY Tsai, CT Wang, CH Hsu
IEEE transactions on components and packaging technologies 29 (3), 625-635, 2006
562006
An experimental investigation of losipescu specimen for composite materials
H Ho, MY Tsai, J Morton, GL Farley
Experimental Mechanics 31, 328-336, 1991
521991
Evaluation of test methods for silicon die strength
MY Tsai, CH Chen
Microelectronics Reliability 48 (6), 933-941, 2008
512008
Investigation on Cu TSV-induced KOZ in silicon chips: Simulations and experiments
MY Tsai, PS Huang, CY Huang, H Jao, B Huang, B Wu, YY Lin, W Liao, ...
IEEE Transactions on Electron Devices 60 (7), 2331-2337, 2013
462013
Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain
MY Tsai, YC Chen, SWR Lee
IEEE Transactions on Components and Packaging Technologies 31 (3), 683-690, 2008
462008
Stress and failure analysis of a pin-loaded composite plate: an experimental study
MY Tsai, J Morton
Journal of Composite Materials 24 (10), 1101-1120, 1990
441990
A note on peel stresses in single-lap adhesive joints
MY Tsai, J Morton
431994
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