| A review of recent advances in thermal management in three dimensional chip stacks in electronic systems V Venkatadri, B Sammakia, K Srihari, D Santos | 91 | 2011 |
| Accelerating the effects of aging on the reliability of lead free solder joints in a quantitative fashion V Venkatadri, L Yin, Y Xing, E Cotts, K Srihari, P Borgesen 2009 59th Electronic Components and Technology Conference, 398-405, 2009 | 47 | 2009 |
| Simulation based alternatives for overall process improvement at the cardiac catheterization lab V Venkatadri, VA Raghavan, V Kesavakumaran, SS Lam, K Srihari Simulation Modelling Practice and Theory 19 (7), 1544-1557, 2011 | 42 | 2011 |
| Reengineering the cardiac catheterization lab processes: a lean approach V Raghavan, V Venkatadri, V Kesavakumaran, S Wang, M Khasawneh, ... Journal of Healthcare Engineering 1 (1), 45-65, 2010 | 25 | 2010 |
| Multi-port device package D Bolognia, V Venkatadri US Patent 9,254,995, 2016 | 14 | 2016 |
| Microphone system with non-orthogonally mounted microphone die AS Khenkin, V Venkatadri, D Bolognia US Patent 9,226,052, 2015 | 11 | 2015 |
| Effect of design parameters on drop test performance of wafer level chip scale packages P Tumne, V Venkatadri, S Kudtarkar, M Delaus, D Santos, R Havens, ... | 10 | 2012 |
| Compact sensor module DF Bolognia, V Venkatadri US Patent 10,340,302, 2019 | 5 | 2019 |
| Negative fillet for mounting an integrated device die to a carrier V Venkatadri, DF Bolognia US Patent 11,056,455, 2021 | 4 | 2021 |
| Reliability Analysis of Censored Data for Drop Testing in Wafer Level Chip Scale Packaging (WLCSP P Tumne, V Venkatadri, S Kudtarkar, D Santos, S Krishnaswami Annual International Conference on Industrial Engineering Theory …, 2010 | 3 | 2010 |
| Electric coil structure V Venkatadri, DF Bolognia, KPL Pun, CW Cheung US Patent 11,295,891, 2022 | 2 | 2022 |
| Fluid delivery system DF Bolognia, JB Harrington, V Venkatadri US Patent App. 17/005,222, 2022 | 2 | 2022 |
| Understanding the effects of process parameters to compensate for substrate warpage in chip on flex (CoF) assembly using conventional reflow V Soman, V Venkatadri, MD Poliks International Symposium on Microelectronics 2019 (1), 000428-000433, 2019 | 2 | 2019 |
| Flex-based surface mount transformer D Bolognia, V Venkatadri US Patent 10,090,094, 2018 | 2 | 2018 |
| Quantitative assessment of long term aging effects on the mechanical properties of lead free solder joints V Venkatadri Binghamton University, 2009 | 2 | 2009 |
| Optimizing System-on-Film (SOF) Design Using Finite Element Analysis V Venkatadri, M Downey, X Xue, D Sengupta, D Santos, R Havens, ... International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 1 | 2011 |
| Shielded integrated device packages V Venkatadri, M Downey, SA Kudtarkar US Patent 12,002,838, 2024 | | 2024 |
| Sensor module V Venkatadri, DF Bolognia US Patent App. 18/247,987, 2023 | | 2023 |
| Fluid control system V Venkatadri, DF Bolognia US Patent 11,796,367, 2023 | | 2023 |
| Battery assembly and method of manufacturing the same KPL Pun, V Venkatadri, DF Bolognia, CW Cheung US Patent 11,764,392, 2023 | | 2023 |
Venkatesh Arasanipalai RaghavanLumileds在 binghamton.edu 的电子邮件经过验证
