| Modeling, Verification, and Signal Integrity Analysis of High-Speed Signaling Channel with Tabbed Routing in High Performance Computing Server Board K Song, J Kim, H Kim, S Lee, J Ahn, A Brito, H Kim, M Park, S Ahn Electronics 10 (13), 1590, 2021 | 7 | 2021 |
| Proposal of electromagnetic pulse (EMP) coupling estimation method to power system including load condition and surge protection device (SPD) H Kim, K Kim, K Song, YM Park, SK Ryu, S Ahn 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 7 | 2020 |
| A novel interposer channel structure with vertical tabbed vias to reduce far-end crosstalk for next-generation high-bandwidth memory H Kim, S Lee, K Song, Y Shin, D Park, J Park, J Cho, S Ahn Micromachines 13 (7), 1070, 2022 | 5 | 2022 |
| Deep reinforcement learning-based power distribution network structure design optimization method for high bandwidth memory interposer S Lee, H Kim, K Song, J Kim, D Park, J Ahn, K Kim, S Ahn 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| Modeling and signal integrity analysis of mounting pad with layer-cutting to reduce impedance mismatch for dual-in-line memory module (DIMM) H Kim, J Kim, K Song, S Lee, K Kim, S Kim, D Lho, H Kim, M Park, S Ahn 2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging …, 2021 | 5 | 2021 |
| Signal integrity analysis of through-silicon via (TSV) with a silicon dioxide well to reduce leakage current for high-bandwidth memory interface H Kim, S Lee, J Park, Y Shin, S Woo, J Kim, J Cho, S Ahn IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 4 | 2023 |
| Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel S Ryu, H Kim, S Lee, D Park, S Lee, S Ahn 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 2 | 2023 |
| Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5 D/3D Package for High-speed Serial Link S Lee, H Kim, J Park, Y Lee, S Moon, S Ahn 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 2 | 2023 |
| Noise source impedance extraction method of switched-mode power supply (SMPS) in PC according to the frequency range J Rhee, H Kim, K Chu, S Ahn 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 2 | 2023 |
| Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs S Lee, H Kim, D Park, J Ahn, S Ryu, G Park, S Ahn 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022 | 2 | 2022 |
| Design and Analysis of LCC-S Wireless Power Transfer Systems Considering Load-Dependent Leakage Magnetic Field S Woo, Y Shin, C Lee, J Moon, H Kim, H Kim, S Huh, S Ahn IEEE Transactions on Electromagnetic Compatibility, 2024 | 1 | 2024 |
| Analysis of Methodology of Breakpoint Detection Method for 22.9 kV Submarine Power cable based on the Time Domain Reflectometer (TDR) H Kim, S Lee, JM Joung, B Park, S Ahn 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 1 | 2023 |
| Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR) H Kim, G Park, S Ryu, J Kim, J Lee, S Ahn 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power …, 2023 | 1 | 2023 |
| Coupling Model of Electromagnetic Pulse to Cable based on System Identification H Kim, K Kim, B Park, J Park, YM Park, SK Ryu, S Ahn 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 1 | 2019 |
| Resonant Frequency Selection Method for Wireless Power Transfer System Considering Electromagnetic Interference Reduction J Park, Y Shin, J Kim, B Park, H Kim, S Ahn 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 1 | 2019 |
| Design Methodology of Through-Silicon via for Crosstalk Optimization Based on Impedance H Kim, S Lee, S Ahn 2024 IEEE Joint International Symposium on Electromagnetic Compatibility …, 2024 | | 2024 |
| Signal Integrity Analysis and Design for Cascaded Wire Bonding of Low-Power Double Data Rate (LPDDR) S Ryu, H Kim, G Park, S Lee, D Park, S Lee, J Rhee, J Kim, S Ahn 2024 IEEE Joint International Symposium on Electromagnetic Compatibility …, 2024 | | 2024 |
| Methodology for Extracting Low-Frequency Input Impedance of Personal Computer During Operation Using Dual Current Probes Method J Rhee, H Kim, K Chu, S Ahn IEEE Transactions on Electromagnetic Compatibility, 2024 | | 2024 |
| 3D-IC Power Distribution Network (PDN) Impedance Prediction using Deep Learning (DL) D Park, S Ryu, H Kim, S Lee, S Song, S Yong, S Ahn 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2023 | | 2023 |
| Power Integrity Design of Mobile 3D-IC Based on the Allocation of Optimal Number of TSV, BGA, and Via H Kim, S Lee, D Park, J Son, Y Lee, S Moon, J Kim, S Ahn 2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2023 | | 2023 |
Seungyoung AhnProfessor, CCS Graduate School for Green Transportation, KAIST在 kaist.ac.kr 的电子邮件经过验证
Seungyoung AhnProfessor, CCS Graduate School for Green Transportation, KAIST在 kaist.ac.kr 的电子邮件经过验证
Yujun Shinkorea Advanced Institute of Science and Technology在 kaist.ac.kr 的电子邮件经过验证
Bumjin ParkPh.D. candidate, KAIST在 kaist.ac.kr 的电子邮件经过验证