| Femtosecond laser-induced periodic structure writing on diamond crystals and microclusters AM Ozkan, AP Malshe, TA Railkar, WD Brown, MD Shirk, PA Molian Applied Physics Letters 75 (23), 3716-3718, 1999 | 233 | 1999 |
| A critical review of chemical vapor-deposited (CVD) diamond for electronic applications TA Railkar, WP Kang, H Windischmann, AP Malshe, HA Naseem, ... Critical reviews in solid state and materials sciences 25 (3), 163-277, 2000 | 80 | 2000 |
| Femtosecond ultraviolet (248 nm) excimer laser processing of Teflon (PTFE) KP Adhi, RL Owings, TA Railkar, WD Brown, AP Malshe Applied surface science 218 (1-4), 17-23, 2003 | 49 | 2003 |
| Chemical modifications in femtosecond ultraviolet (248 nm) excimer laser radiation-processed polyimide KP Adhi, RL Owings, TA Railkar, WD Brown, AP Malshe Applied surface science 225 (1-4), 324-331, 2004 | 36 | 2004 |
| Substrate vias for heat removal from semiconductor die TA Railkar, A Alawani, R Parkhurst US Patent 8,946,904, 2015 | 32 | 2015 |
| Integrated circuit package including a three-dimensional fan-out/fan-in signal routing TA Railkar, SD Cate US Patent 7,982,305, 2011 | 30 | 2011 |
| Integrated circuit package including a three-dimensional fan-out/fan-in signal routing TA Railkar, SD Cate US Patent 8,921,995, 2014 | 26 | 2014 |
| Passivation of material using ultra-fast pulsed laser TA Railkar, AP Malshe, WD Brown US Patent 7,112,545, 2006 | 24 | 2006 |
| Semiconductor structure comprising pillar R Parkhurst, T Railkar, W Snodgrass US Patent 8,314,472, 2012 | 22 | 2012 |
| Thermally enhanced semiconductor package TA Railkar, SD Cate US Patent 8,018,051, 2011 | 20 | 2011 |
| Laminate-based package with internal overmold KJ Anderson, TA Railkar, WM Meliane US Patent 10,390,434, 2019 | 16 | 2019 |
| Study of surface states in (110) n‐GaAs by exoelectron emission measurements TA Railkar, RS Bhide, SV Bhoraskar, V Manorama, VJ Rao Journal of applied physics 72 (1), 155-157, 1992 | 15 | 1992 |
| Crystallite-size-dependent characteristics of porous silicon SV Bhoraskar, T Bhave, TA Railkar Bulletin of Materials Science 17, 523-531, 1994 | 12 | 1994 |
| Package for high-power semiconductor devices TA Railkar, DC Dumka US Patent 8,946,894, 2015 | 11 | 2015 |
| Defect studies in oxygen‐ion‐irradiated silicon‐based metal‐insulator‐semiconductor structures TA Railkar, SV Bhoraskar, SD Dhole, VN Bhoraskar Journal of applied physics 74 (7), 4343-4346, 1993 | 11 | 1993 |
| Integrated circuit (IC) package with embedded heat spreader in a redistribution layer (RDL) KJ Anderson, AA Ketterson, TA Railkar, DC Dumka, C Bojkov US Patent 11,626,340, 2023 | 10 | 2023 |
| Thermal management issues and evaluation of a novel, flexible substrate, 3-dimensional (3-D) packaging concept WD Brown, AP Malshe, TA Railkar, TG Lenihan, JW Stone, WT Sommers, ... Proceedings. 1998 International Conference on Multichip Modules and High …, 1998 | 9 | 1998 |
| Air-cavity package with two heat dissipation interfaces TA Railkar, KJ Anderson, WM Meliane US Patent 9,974,158, 2018 | 8 | 2018 |
| Ultrashort pulse ultraviolet laser treatment of Microstructural modifications and passivation effects TA Railkar, AP Malshe, WD Brown, SS Hullavarad, SV Bhoraskar Journal of Applied Physics 89 (9), 4766-4771, 2001 | 8 | 2001 |
| Air-cavity package with enhanced package integration level and thermal performance WM Meliane, KJ Anderson, TA Railkar US Patent 9,991,181, 2018 | 7 | 2018 |
