| Volumetric ultrasound imaging using 2-D CMUT arrays O Oralkan, AS Ergun, CH Cheng, JA Johnson, M Karaman, TH Lee, ... IEEE transactions on ultrasonics, ferroelectrics, and frequency control 50 …, 2003 | 235 | 2003 |
| Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same Y Huang, X Zhuang, BT Khuri-Yakub, CH Cheng, AS Ergun US Patent 7,545,075, 2009 | 107 | 2009 |
| Silicon micromachined ultrasonic transducers BT Khuri-Yakub, CH Cheng, FL Degertekin, S Ergun, S Hansen, XC Jin, ... ASME International Mechanical Engineering Congress and Exposition 19098, 153-171, 2000 | 94 | 2000 |
| An efficient electrical addressing method using through-wafer vias for two-dimensional ultrasonic arrays CH Cheng, EM Chow, X Jin, S Ergun, BT Khuri-Yakub 2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium …, 2000 | 92 | 2000 |
| Low ON-Resistance SiC Trench/Planar MOSFET with Reduced OFF-State Oxide Field and Low Gate Charges KJC Jin Wei, Meng Zhang, Huaping Jiang, Ching-Hsiang Cheng IEEE Electron Device Letters 37 (11), 1458 - 1461, 2016 | 88 | 2016 |
| Capacitive micromachined ultrasonic transducers with piston-shaped membranes: Fabrication and experimental characterization Y Huang, X Zhuang, EO Haeggstrom, AS Ergun, CH Cheng, ... IEEE transactions on ultrasonics, ferroelectrics, and frequency control 56 …, 2009 | 73 | 2009 |
| A novel fluidic strain sensor for large strain measurement YN Cheung, Y Zhu, CH Cheng, C Chao, WWF Leung Sensors and actuators a: Physical 147 (2), 401-408, 2008 | 68 | 2008 |
| Comparison of conventional and collapsed region operation of capacitive micromachined ultrasonic transducers Y Huang, E Haeggstrom, B Bayram, X Zhuang, AS Ergun, CH Cheng, ... ieee transactions on ultrasonics, ferroelectrics, and frequency control 53 …, 2006 | 60 | 2006 |
| Electrical through wafer interconnects CH Cheng, AS Ergun, BT Khuri-Yakub US Patent 6,836,020, 2004 | 60 | 2004 |
| Capacitive micromachined ultrasonic transducers (CMUTs) with isolation posts Y Huang, X Zhuang, EO Haeggstrom, AS Ergun, CH Cheng, ... Ultrasonics 48 (1), 74-81, 2008 | 54 | 2008 |
| Electrical through-wafer interconnects with sub-picofarad parasitic capacitance [MEMS packaging] CH Cheng, AS Ergun, BT Khuri-Yakub 2001 Microelectromechanical Systems Conference (Cat. No. 01EX521), 18-21, 2001 | 54 | 2001 |
| Highly integrated 2-D capacitive micromachined ultrasonic transducers S Calmes, CH Cheng, FL Degertekin, XC Jin, S Ergun, BT Khuri-Yakub 1999 IEEE Ultrasonics Symposium. Proceedings. International Symposium (Cat …, 1999 | 47 | 1999 |
| Strain sensor CH Cheng, C Chao, ZHU Yun US Patent 7,854,173, 2010 | 46 | 2010 |
| Broadband capacitive micromachined ultrasonic transducers ranging from 10 kHz to 60 MHz for imaging arrays and more AS Ergun, Y Huang, CH Cheng, O Oralkan, J Johnson, H Jagannathan, ... 2002 IEEE Ultrasonics Symposium, 2002. Proceedings. 2, 1039-1043, 2002 | 46 | 2002 |
| Measurement and modeling of liquid film thickness evolution in stratified two-phase microchannel flows JE Steinbrenner, CH Hidrovo, FM Wang, S Vigneron, ES Lee, TA Kramer, ... Applied Thermal Engineering 27 (10), 1722-1727, 2007 | 43 | 2007 |
| Lamb wave devices using capacitive micromachined ultrasonic transducers GG Yaralioglu, MH Badi, AS Ergun, CH Cheng, BT Khuri-Yakub, ... Applied Physics Letters 78 (1), 111-113, 2001 | 40 | 2001 |
| Advanced cooling technologies for microprocessors TW Kenny, KE Goodson, JG Santiago, E Wang, JM Koo, L Jiang, E Pop, ... International journal of high speed electronics and systems 16 (01), 301-313, 2006 | 39 | 2006 |
| A novel ionic-liquid strain sensor for large-strain applications Y Zhu, C Chao, CH Cheng, WWF Leung Ieee electron device letters 30 (4), 337-339, 2009 | 37 | 2009 |
| An EGaIn-based flexible piezoresistive shear and normal force sensor with hysteresis analysis in normal force direction X Shi, CH Cheng, Y Zheng, PKA Wai Journal of Micromechanics and Microengineering 26 (10), 105020, 2016 | 35 | 2016 |
| Electrical through wafer interconnects with 0.05 pico farads parasitic capacitance on 400 μm thick silicon substrate CH Cheng, AS Ergun, BT Khuri-Yakub Solid State Sensor, Actuator and Microsystems Workshop, Hilton Head Island …, 2002 | 35 | 2002 |
Ömer OralkanNorth Carolina State University在 ncsu.edu 的电子邮件经过验证
