| The effects of aging on the fatigue life of lead free solders M Mustafa, JC Roberts, JC Suhling, P Lall 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 666-683, 2014 | 83 | 2014 |
| Evolution of the tension/compression and shear cyclic stress-strain behavior of lead-free solder subjected to isothermal aging M Mustafa, Z Cai, JC Roberts, JC Suhling, P Lall 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 65 | 2012 |
| The Anand parameters for SAC solders after extreme aging M Basit, S Ahmed, M Motalab, JC Roberts, JC Suhling, P Lall 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 60 | 2016 |
| Continuous in-situ die stress measurements during thermal cycling accelerated life testing MK Rahim, J Roberts, JC Suhling, RC Jaeger, P Lall 2007 Proceedings 57th Electronic Components and Technology Conference, 1478-1489, 2007 | 36 | 2007 |
| Characterization of microprocessor chip stress distributions during component packaging and thermal cycling J Roberts, S Hussain, MK Rahim, M Motalab, JC Suhling, RC Jaeger, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 30 | 2010 |
| Measurement of die stresses in microprocessor packaging due to thermal and power cycling J Roberts, M Motalab, S Hussain, JC Suhling, RC Jaeger, P Lall 2012 IEEE 62nd Electronic Components and Technology Conference, 756-770, 2012 | 21 | 2012 |
| Application of stress sensing test chips to area array packaging JC Suhling, RC Jaeger, P Lall, MK Rahim, JC Roberts, S Hussain EuroSimE 2009-10th International Conference on Thermal, Mechanical and Multi …, 2009 | 19 | 2009 |
| The effects of silver content and solidification profile on the Anand constitutive model for SAC lead free solders MM Basit, M Motalab, JC Roberts, JC Suhling, P Lall Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 17 | 2014 |
| Characterization of compressive die stresses in CBGA microprocessor packaging due to component assembly and heat sink clamping JC Roberts, M Motalab, S Hussain, JC Suhling, RC Jaeger, P Lall Journal of Electronic Packaging 134 (3), 031005, 2012 | 16 | 2012 |
| Squeezing the chip: The buildup of compressive stress in a microprocessor chip by packaging and heat sink clamping JC Roberts, M Motalab, S Hussain, JC Suhling, RC Jaeger, P Lall 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 406-423, 2011 | 15 | 2011 |
| Error analysis for piezoresistive stress sensors used in flip chip packaging S Hussain, RC Jaeger, JC Suhling, JC Roberts, MA Motalab, CH Cho 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 13 | 2010 |
| Die stress variation in area array components subjected to accelerated life testing JC Roberts, MK Rahim, S Hussain, JC Suhling, RC Jaeger, P Lall 2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2008 | 11 | 2008 |
| Stress measurements in large area array flip chip microprocessor chips JC Roberts, MK Rahim, JC Suhling, RC Jaeger, P Lall, R Zhang, J Jones 2008 58th Electronic Components and Technology Conference, 1462-1471, 2008 | 9 | 2008 |
| Moisture-Induced Die Stresses in PBGA Packages Exposed to Various Environments J Chen, Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 8 | 2018 |
| Characterization of moisture and thermally induced die stresses in flip chip on laminate assemblies Q Nguyen, JC Roberts, JC Suhling, RC Jaeger Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 8 | 2014 |
| Measurement of die stress distributions in flip chip CBGA packaging J Roberts, S Hussain, MK Rahim, M Motalab, JC Suhling, RC Jaeger, ... 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 8 | 2010 |
| A study on die stresses in flip chip package subjected to various hygrothermal exposures Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 7 | 2018 |
| Characterization of moisture induced die stresses in flip chip packaging Q Nguyen, JC Roberts, JC Suhling, RC Jaeger, P Lall 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 789-798, 2016 | 7 | 2016 |
| Measurement and simulation of moisture induced die stresses in quad flat packages Q Nguyen, JC Roberts, JC Suhling, RC Jaeger 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 7 | 2016 |
| Characterization of die stresses in plastic packages subjected to moisture and thermal exposures Q Nguyen, MK Rahim, JC Roberts, JC Suhling, RC Jaeger International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 7 | 2015 |
