| Solder paste scooping detection by multilevel visual inspection of printed circuit boards C Benedek, O Krammer, M Janóczki, L Jakab IEEE Transactions on Industrial Electronics 60 (6), 2318-2331, 2012 | 65 | 2012 |
| Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics B Medgyes, B Horváth, B Illés, T Shinohara, A Tahara, G Harsányi, ... Corrosion Science 92, 43-47, 2015 | 50 | 2015 |
| Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering O Krammer Soldering & Surface Mount Technology 26 (4), 214-222, 2014 | 47 | 2014 |
| Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab Journal of Alloys and Compounds 634, 156-162, 2015 | 38 | 2015 |
| Modelling the self-alignment of passive chip components during reflow soldering O Krammer Microelectronics Reliability 54 (2), 457-463, 2014 | 38 | 2014 |
| A review on current eCall systems for autonomous car accident detection A Bonyár, A Géczy, O Krammer, H Sántha, B Illés, J Kámán, Z Szalay, ... 2017 40th International Spring Seminar on Electronics Technology (ISSE), 1-8, 2017 | 37 | 2017 |
| Application of ZnO nanoparticles in Sn99Ag0. 3Cu0. 7-based composite solder alloys A Skwarek, O Krammer, T Hurtony, P Ptak, K Górecki, S Wroński, ... Nanomaterials 11 (6), 1545, 2021 | 34 | 2021 |
| Analysis of no-clean flux spatter during the soldering process P Veselý, D Bušek, O Krammer, K Dušek Journal of materials processing technology 275, 116289, 2020 | 34 | 2020 |
| Analysing machine learning techniques for predicting the hole-filling in pin-in-paste technology P Martinek, O Krammer Computers & Industrial Engineering 136, 187-194, 2019 | 33 | 2019 |
| Numerical modelling of the heat and mass transport processes in a vacuum vapour phase soldering system B Illés, A Skwarek, A Géczy, O Krammer, D Bušek International Journal of heat and mass transfer 114, 613-620, 2017 | 28 | 2017 |
| Investigating the mechanical strength of vapor phase soldered chip components joints O Krammer, T Garami 2010 IEEE 16th International Symposium for Design and Technology in …, 2010 | 25 | 2010 |
| The effect of solder paste particle size on the thixotropic behaviour during stencil printing O Krammer, B Gyarmati, A Szilágyi, B Illés, D Bušek, K Dušek Journal of materials processing technology 262, 571-576, 2018 | 22 | 2018 |
| Reflow soldering: apparatus and heat transfer processes B Illés, O Krammer, A Geczy Elsevier, 2020 | 20 | 2020 |
| Optimising pin-in-paste technology using gradient boosted decision trees P Martinek, O Krammer Soldering & Surface Mount Technology 30 (3), 164-170, 2018 | 19 | 2018 |
| Modelling the effect of uneven PWB surface on stencil bending during stencil printing process O Krammer, LM Molnár, L Jakab, A Szabó Microelectronics Reliability 52 (1), 235-240, 2012 | 18 | 2012 |
| Comparing the intermetallic layer formation of Infrared and Vapour Phase soldering O Krammer, T Garami Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 18 | 2011 |
| Influence of vapor phase soldering fluid Galden on wetting forces (tombstone effect) K Dušek, D Bušek, M Plaček, A Géczy, O Krammer, B Illés Journal of Materials Processing Technology 251, 20-25, 2018 | 17 | 2018 |
| Corrosion-induced tin whisker growth in electronic devices: A review B Illés, B Horváth, A Géczy, O Krammer, K Dušek Soldering & Surface Mount Technology 29 (1), 59-68, 2017 | 17 | 2017 |
| New method for determining correction factors for pin-in-paste solder volumes O Krammer, B Varga, K Dušek Soldering & Surface Mount Technology 29 (1), 2-9, 2017 | 16 | 2017 |
| Investigating the self-alignment of chip components during reflow soldering O Krammer, Z Illyefalvi-Vitéz Periodica Polytechnica Electrical Engineering (Archives) 52 (1-2), 67-75, 2008 | 16 | 2008 |
