Molecular dynamics simulations of deformation mechanisms of amorphous polyethylene D Hossain, MA Tschopp, DK Ward, JL Bouvard, P Wang, MF Horstemeyer Polymer 51 (25), 6071-6083, 2010 | 473 | 2010 |
Probing grain boundary sink strength at the nanoscale: Energetics and length scales of vacancy and interstitial absorption by grain boundaries in -Fe MA Tschopp, KN Solanki, F Gao, X Sun, MA Khaleel, MF Horstemeyer Physical Review B 85 (6), 064108, 2012 | 359 | 2012 |
Asymmetric tilt grain boundary structure and energy in copper and aluminium MA Tschopp, DL McDowell Philosophical Magazine 87 (25), 3871-3892, 2007 | 324 | 2007 |
Structures and energies of asymmetric tilt grain boundaries in copper and aluminium MA Tschopp, DL McDowell Philosophical Magazine 87 (22), 3147-3173, 2007 | 300 | 2007 |
Tensile strength of and tilt bicrystal copper interfaces DE Spearot, MA Tschopp, KI Jacob, DL McDowell Acta Materialia 55 (2), 705-714, 2007 | 294* | 2007 |
Porosity prediction: Supervised-learning of thermal history for direct laser deposition M Khanzadeh, S Chowdhury, M Marufuzzaman, MA Tschopp, L Bian Journal of Manufacturing Systems 47, 69-82, 2018 | 282 | 2018 |
In-situ monitoring of melt pool images for porosity prediction in directed energy deposition processes M Khanzadeh, S Chowdhury, MA Tschopp, HR Doude, M Marufuzzaman, ... IISE Transactions 51 (5), 437-455, 2019 | 257 | 2019 |
Effect of grain boundaries on texture formation during dynamic recrystallization of magnesium alloys CD Barrett, A Imandoust, AL Oppedal, K Inal, MA Tschopp, H El Kadiri Acta Materialia 128, 270-283, 2017 | 219 | 2017 |
Influence of single crystal orientation on homogeneous dislocation nucleation under uniaxial loading MA Tschopp, DL McDowell Journal of the Mechanics and Physics of Solids 56 (5), 1806-1830, 2008 | 215 | 2008 |
Symmetric and asymmetric tilt grain boundary structure and energy in Cu and Al (and transferability to other fcc metals) MA Tschopp, SP Coleman, DL McDowell Integrating Materials and Manufacturing Innovation 4, 176-189, 2015 | 199 | 2015 |
Atomistic simulations of homogeneous dislocation nucleation in single crystal copper MA Tschopp, DE Spearot, DL McDowell Modelling and Simulation in Materials Science and Engineering 15 (7), 693, 2007 | 160 | 2007 |
Quantifying geometric accuracy with unsupervised machine learning: Using self-organizing map on fused filament fabrication additive manufacturing parts M Khanzadeh, P Rao, R Jafari-Marandi, BK Smith, MA Tschopp, L Bian Journal of Manufacturing Science and Engineering 140 (3), 031011, 2018 | 159 | 2018 |
Dislocation nucleation in asymmetric tilt grain boundaries MA Tschopp, DL McDowell International Journal of Plasticity 24 (2), 191-217, 2008 | 153 | 2008 |
Mitigating grain growth in binary nanocrystalline alloys through solute selection based on thermodynamic stability maps KA Darling, MA Tschopp, BK VanLeeuwen, MA Atwater, ZK Liu Computational Materials Science 84, 255-266, 2014 | 149 | 2014 |
Dual process monitoring of metal-based additive manufacturing using tensor decomposition of thermal image streams M Khanzadeh, W Tian, A Yadollahi, HR Doude, MA Tschopp, L Bian Additive Manufacturing 23, 443-456, 2018 | 144 | 2018 |
Atomic-scale analysis of liquid-gallium embrittlement of aluminum grain boundaries M Rajagopalan, MA Bhatia, MA Tschopp, DJ Srolovitz, KN Solanki Acta Materialia 73, 312-325, 2014 | 140 | 2014 |
Breakdown of the Schmid law in homogeneous and heterogeneous nucleation events of slip and twinning in magnesium CD Barrett, H El Kadiri, MA Tschopp Journal of the Mechanics and Physics of Solids 60 (12), 2084-2099, 2012 | 136 | 2012 |
Structure and free volume of symmetric tilt grain boundaries with the E structural unit MA Tschopp, GJ Tucker, DL McDowell Acta Materialia 55 (11), 3959-3969, 2007 | 136 | 2007 |
Grain boundary dislocation sources in nanocrystalline copper MA Tschopp, DL McDowell Scripta Materialia 58 (4), 299-302, 2008 | 131 | 2008 |
Microstructure and mechanical properties of bulk nanostructured Cu–Ta alloys consolidated by equal channel angular extrusion KA Darling, MA Tschopp, RK Guduru, WH Yin, Q Wei, LJ Kecskes Acta Materialia 76, 168-185, 2014 | 129 | 2014 |