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Wei Jian
Wei Jian
Tsinghua University
在 mails.tsinghua.edu.cn 的电子邮件经过验证
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引用次数
引用次数
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Wrap-like transfer printing for three-dimensional curvy electronics
X Chen#, W Jian#, Z Wang, J Ai, Y Kang, P Sun, Z Wang, Y Ma, H Wang, ...
Science Advances 9 (30), eadi0357, 2023
292023
Subsurface damage and bending strength analysis for ultra-thin and flexible silicon chips
W Jian, ZX Wang, P Jin, LJ Zhu, Y Chen, X Feng
Science China Technological Sciences 66 (1), 215-222, 2023
82023
Photothermal-Responsive Lightweight Hydrogel Actuator Loaded with Polydopamine-Modified Hollow Glass Microspheres
Z Zhang, F Zhang, W Jian, Y Chen, X Feng
ACS Applied Materials & Interfaces 16 (18), 23914-23923, 2024
32024
Competing behavior of interface delamination and wafer cracking during peeling film from ultra-thin wafer
W Jian, H Yin, Y Chen, X Feng
International Journal of Solids and Structures 305, 113058, 2024
12024
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