| Simultaneous measurement of electric and magnetic fields with a dual probe for efficient near-field scanning W Shao, W Fang, Y Huang, G Li, L Wang, Z He, E Shao, Y Guo, Y En, ... IEEE Transactions on Antennas and Propagation 67 (4), 2859-2864, 2019 | 65 | 2019 |
| Multi-Ports ([) 2×-Thru De-Embedding: Theory, Validation, and Mode Conversion Characterization B Chen, J He, Y Guo, S Pan, X Ye, J Fan IEEE Transactions on Electromagnetic Compatibility 61 (4), 1261-1270, 2019 | 32 | 2019 |
| 电磁兼容设计与整改对策及案例分析 郭远东朱文立，陈燕，肖猛， Publishing House of Electronics Industry (China), 2012 | 29* | 2012 |
| IEC 61000-4-2 ESD test in display down configurationfor cell phones J Zhou, S Shinde, Y Guo, A Talebzadeh, S Marathe, Y Gan, KH Kim, ... 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC …, 2016 | 21 | 2016 |
| Systematic characterization of dual probes for electromagnetic near-field measurement W Shao, X Tian, R Chen, X He, W Fang, P Lai, G Lu, Y Guo, L Wang, ... IEEE Sensors Journal 21 (4), 4713-4722, 2020 | 20 | 2020 |
| Differential S-parameter de-embedding for 8-port network B Chen, J He, X Sun, Y Guo, S Jin, X Ye, J Fan 2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and …, 2018 | 20 | 2018 |
| Measurement techniques to predict the soft failure susceptibility of an IC without the aid of a complete software stack S Yang, B Orr, Y Guo, Y Zhang, D Pommerenke, H Shumiya, J Maeshima, ... 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 41-45, 2016 | 16 | 2016 |
| A cross-sectional profile based model for stripline conductor surface roughness S Yong, V Khilkevich, Y Liu, R He, Y Guo, H Gao, S Hinaga, D Padilla, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 13 | 2020 |
| Measurement techniques to identify soft failure sensitivity to ESD J Zhou, Y Guo, S Shinde, A Hosseinbeig, A Patnaik, OH Izadi, C Zeng, ... IEEE transactions on electromagnetic compatibility 62 (4), 1007-1016, 2019 | 13 | 2019 |
| Investigation of segmentation method for enhancing high frequency simulation accuracy of Q3D extractor C Che, H Zhao, Y Guo, J Hu, H Kim 2019 IEEE International Conference on Computational Electromagnetics (ICCEM …, 2019 | 13 | 2019 |
| Limitations of first-order surface impedance boundary condition and its effect on 2D simulations for PCB transmission lines Y Guo, DH Kim, J He, S Yong, Y Liu, X Ye, J Fan 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 12 | 2020 |
| Causality analyzing for transmission line with surface roughness X Sun, Y Guo, Y Sun, K Song, L Ye, X Ye, JL Drewniak, J Fan 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal …, 2019 | 12 | 2019 |
| Study of TDR impedance for better analysis to measurement correlation Y Guo, B Chen, X Sun, X Ye, J Hsu, J Fan 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo …, 2019 | 11 | 2019 |
| Far-end crosstalk control strategy for high-volume high-speed PCB manufacturing: The concept of critical resin content percent Y Guo, S Yong, Y Liu, J He, B Pu, X Ye, A Sutono, V Kunda, A Luoh, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 820-824, 2021 | 9 | 2021 |
| The simulated TDR impedance in PCB material characterization Y Guo, DH Kim, J He, S Yong, Y Liu, B Pu, X Ye, J Fan 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 831-834, 2021 | 8 | 2021 |
| Far-end crosstalk analysis for stripline with inhomogeneous dielectric layers (IDL) Y Liu, S Yong, Y Guo, J He, L Liu, N Kutheis, A Sutono, V Kunda, A Luoh, ... 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 825-830, 2021 | 8 | 2021 |
| Signal Integrity Design Methodology for Package in Co-packaged Optics Based on Figure of Merit as Channel Operating Margin B Pu, J He, A Harmon, Y Guo, Y Liu, Q Cai 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, 492-497, 2021 | 8 | 2021 |
| Robust extended unterminated line (EUL) crosstalk characterization techniques for high-speed interconnect Y Guo, DH Kim, J He, X Ye, A Sutono, V Kunda, A Luoh, Z Kiguradze, ... 2020 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2020 | 8 | 2020 |
| An empirical modeling of far-end crosstalk and insertion loss in microstrip lines Y Liu, S Yong, Y Guo, J He, C Li, X Ye, J Fan, V Khilkevich, DH Kim IEEE Transactions on Signal and Power Integrity 1, 130-139, 2022 | 6 | 2022 |
| Ground bridge effect on reduction of conducted emission from three-phase motor drive system Y Guo, S Penugonda, M Kim, J Lee, J Ha, S Yun, J Fan, H Kim 2019 International Symposium on Electromagnetic Compatibility-EMC EUROPE …, 2019 | 6 | 2019 |
Xiaoning YeIntel Corp在 intel.com 的电子邮件经过验证
