| Reflow recipe establishment based on CFD-Informed machine learning model Y Lai, JH Ha, KA Deo, J Yang, P Yin, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 11 | 2023 |
| A deep learning approach for reflow profile prediction Y Lai, J Kataoka, K Pan, J Ha, J Yang, KA Deo, J Xu, P Yin, C Cai, S Park 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2269-2274, 2022 | 11 | 2022 |
| A study on parameters that impact the thermal fatigue life of BGA solder joints K Arun Deo, RN Kono, C Cai, J Yang, Y Lai, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 10 | 2022 |
| Thermomechanical reliability of BGA packages with different underfill reinforcement methods Y Lai, C Cai, K Pan, J Yang, J Ha, P Yin, K Deo, S Park International Electronic Packaging Technical Conference and Exhibition 86557 …, 2022 | 9 | 2022 |
| Characterization of constitutive equation of Sn-Bi by studying creep behavior of flip chip solder joints C Cai, K Pan, K Deo, Y Lai, J Yang, J Wang, S Park 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical …, 2022 | 5 | 2022 |
| Influence of copper pad dimension on thermal fatigue life performance of BGA Packages KA Deo, S Park, RN Kono IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 2 | 2023 |
| A Technical Review on State of the Art In-Plane and Out-of-Plane Deformation Measurement Techniques for Microelectronic Packages KA Deo, P Yin, J Yang, JH Ha, SB Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 907-913, 2023 | 2 | 2023 |
| Reflow Oven Zone Temperature Advisor using the AI-Driven Smart Recipe Generator Y Lai, P Yin, J Yang, J Ha, KA Deo, S Park 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1773-1778, 2023 | 1 | 2023 |
| Influence of Stiffener Design on Co-Packaged Optics (CPO) 2.5 D Heterogeneous Packages KA Deo, Y Lai, J Yang, JH Ha, S Park 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1814-1819, 2024 | | 2024 |
| Bond-line Thickness Prediction for Thermal Interface Material under Usage Conditions Y Lai, X Jiefeng, J Ha, KA Deo, J Yang, S Park 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1538-1542, 2024 | | 2024 |
| Reliability of Differently Shaped Solder Joints in Chip Resistor Under Drop Impact J Ha, KA Deo, J Yang, Y Lai, S Park 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1639-1643, 2024 | | 2024 |
| A CALIBRATION TECHNIQUE OF THERMOCHROMIC LIQUID CRYSTAL SHEETS USING ARTIFICIAL NEURAL NETWORKS–A NOVEL ALTERNATIVE K Deo, C Balaji International Heat Transfer Conference Digital Library, 2018 | | 2018 |
Seungbae ParkProfessor of Mechanical Engineering, Binghamton University在 binghamton.edu 的电子邮件经过验证
