| Practical design considerations for a Si IGBT+ SiC MOSFET hybrid switch: Parasitic interconnect influences, cost, and current ratio optimization A Deshpande, F Luo IEEE Transactions on Power Electronics 34 (1), 724-737, 2018 | 117 | 2018 |
| Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing Z Yuan, H Peng, A Deshpande, B Narayanasamy, AI Emon, F Luo, ... IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 395-406, 2019 | 86 | 2019 |
| Design of a high-efficiency, high specific-power three-level T-type power electronics building block for aircraft electric-propulsion drives A Deshpande, Y Chen, B Narayanasamy, Z Yuan, C Chen, F Luo IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 407-416, 2019 | 75 | 2019 |
| Design of a silicon-WBG hybrid switch A Deshpande, F Luo 2015 IEEE 3rd Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2015 | 56 | 2015 |
| Improved space vector modulation for neutral-point balancing control in hybrid-switch-based T-type neutral-point-clamped inverters with loss and common-mode voltage reduction H Peng, Z Yuan, X Zhao, B Narayanasamy, A Deshpande, AI Emon, ... CPSS Transactions on Power Electronics and Applications 4 (4), 328-338, 2019 | 46 | 2019 |
| Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ... 2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019 | 39 | 2019 |
| Comprehensive evaluation of a silicon-WBG hybrid switch A Deshpande, F Luo 2016 IEEE Energy Conversion Congress and Exposition (ECCE), 1-8, 2016 | 38 | 2016 |
| Stacked DBC cavitied substrate for a 15-kV half-bridge power module A Deshpande, F Luo, A Iradukunda, D Huitink, L Boteler 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP), 12-17, 2019 | 33 | 2019 |
| Comprehensive analysis of three-phase three-level t-type neutral-point-clamped inverter with hybrid switch combination H Peng, Z Yuan, B Narayanasamy, X Zhao, A Deshpande, F Luo 2019 IEEE 10th International Symposium on Power Electronics for Distributed …, 2019 | 32 | 2019 |
| A three-level, T-type, power electronics building block using Si-SiC hybrid switch for high-speed drives A Deshpande, Y Chen, B Narayanasamy, AS Sathyanarayanan, F Luo 2018 IEEE Applied Power Electronics Conference and Exposition (APEC), 2609-2616, 2018 | 31 | 2018 |
| Thermal and electrical performance in high-voltage power modules with nonmetallic additively manufactured impingement coolers R Whitt, D Huitink, A Emon, A Deshpande, F Luo IEEE transactions on power electronics 36 (3), 3192-3199, 2020 | 30 | 2020 |
| 1200 V/650 V/160 A SiC+ Si IGBT 3L hybrid T-type NPC power module with enhanced EMI shielding AI Emon, Z Yuan, AB Mirza, A Deshpande, MU Hassan, F Luo IEEE Transactions on Power Electronics 36 (12), 13660-13673, 2021 | 29 | 2021 |
| Impact of cable and motor loads on wide bandgap device switching and reflected wave phenomenon in motor drives B Narayanasamy, AS Sathyanarayanan, A Deshpande, F Luo 2017 IEEE Applied Power Electronics Conference and Exposition (APEC), 931-937, 2017 | 25 | 2017 |
| Multilayer busbar design for a Si IGBT and SiC MOSFET hybrid switch based 100 kW three-level T-type PEBB A Deshpande, F Luo 2017 IEEE 5th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2017 | 23 | 2017 |
| A 1200V/650V/160A sic+ Si IGBT 3-level T-type NPC power module with optimized loop inductance AI Emon, Z Yuan, A Deshpande, H Peng, R Paul, F Luo 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 717-722, 2020 | 20 | 2020 |
| Toward partial discharge reduction by corner correction in power module layouts S Mukherjee, T Evans, B Narayanasamy, Q Le, AI Emon, A Deshpande, ... 2018 IEEE 19th Workshop on Control and Modeling for Power Electronics …, 2018 | 19 | 2018 |
| Comparison between 1.7 kV SiC SJT and MOSFET power modules G Li, H Li, A Deshpande, X Li, L Xu, F Luo, J Wang 2016 IEEE 4th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2016 | 17 | 2016 |
| Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ... 2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019 | 16 | 2019 |
| Insulation design and optimization of laminated busbar for more electric aircraft motor drive under high altitude and depressurized environments Z Yuan, Y Wang, AI Emon, Z Wang, B Narayanasamy, A Deshpande, ... 2020 AIAA/IEEE Electric Aircraft Technologies Symposium (EATS), 1-9, 2020 | 15 | 2020 |
| High power density 1700-V/300-A Si-IGBT and SiC-MOSFET hybrid switch-based half-bridge power module A Deshpande, A Imran, R Paul, Z Yuan, H Peng, F Luo 2020 IEEE Energy Conversion Congress and Exposition (ECCE), 3979-3986, 2020 | 14 | 2020 |
Fang LuoStony Brook University (SUNY Stony Brook), NY在 stonybrook.edu 的电子邮件经过验证
