| The need and opportunities of electromigration-aware integrated circuit design S Bigalke, J Lienig, G Jerke, J Scheible, R Jancke 2018 IEEE/ACM International Conference on Computer-Aided Design (ICCAD), 1-8, 2018 | 14 | 2018 |
| Load-aware redundant via insertion for electromigration avoidance S Bigalke, J Lienig Proceedings of the 2016 on International Symposium on Physical Design, 99-106, 2016 | 14 | 2016 |
| Avoidance vs. repair: New approaches to increasing electromigration robustness in VLSI routing S Bigalke, J Lienig Integration 75, 189-198, 2020 | 10 | 2020 |
| FLUTE-EM: Electromigration-optimized net topology considering currents and mechanical stress S Bigalke, J Lienig 2018 IFIP/IEEE International Conference on Very Large Scale Integration …, 2018 | 7 | 2018 |
| Exploring the use of the finite element method for electromigration analysis in future physical design M Thiele, S Bigalke, J Lienig 2017 IFIP/IEEE International Conference on Very Large Scale Integration …, 2017 | 6 | 2017 |
| Increasing EM robustness of placement and routing solutions based on layout-driven discretization S Bigalke, J Lienig, T Casper, S Schöps 2018 14th Conference on Ph. D. Research in Microelectronics and Electronics …, 2018 | 5 | 2018 |
| Electromigration analysis of VLSI circuits using the finite element method M Thiele, S Bigalke, J Lienig VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things: 25th …, 2019 | 4 | 2019 |
| Electro-, Stress-and Thermomigration: Three Forces, One Problem S Bigalke, J Lienig | | 2016 |
Jens LienigTU Dresden在 ifte.de 的电子邮件经过验证
Jens LienigTU Dresden在 ifte.de 的电子邮件经过验证
Thorben CasperTechnische Universität Darmstadt在 temf.tu-darmstadt.de 的电子邮件经过验证