| A study of electromechanical behaviors of printed conductive leads on stretchable textiles for smart clothing KUS Somarathna, B Garakani, M Alhendi, E Enakerakpo, P Borgesen, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2157-2166, 2020 | 14 | 2020 |
| Performance evaluation of RF novel microstrip lines printed on flexible substrates AS Obeidat, M Alhendi, MY Abdelatty, A Umar, E Enakerakpo, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1471-1477, 2023 | 11 | 2023 |
| Fully additive manufacturing of passive circuit elements using aerosol jet printing E Enakerakpo, M Alhendi, GS Khinda, B Garakani, KUS Somarathna, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1138-1143, 2021 | 11 | 2021 |
| Effects of process parameters and isothermal fatigue cycling on electromechanical properties of screen-printed interconnect on nonwovens for wearable electronics B Garakani, KUS Somarathna, GS Khinda, E Enakerakpo, M Alhendi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2167-2174, 2020 | 10 | 2020 |
| Electrical and Mechanical Behavior of Aerosol Jet–Printed Gold on Alumina Substrate for High‐Temperature Applications F Alshatnawi, M Alhendi, EM Abbara, R Sivasubramony, B Garakani, ... Advanced Engineering Materials 25 (20), 2300439, 2023 | 4 | 2023 |
| Modeling the effect of hatched grounds on the radio-frequency performance of microstrip lines on flexible substrate MY Abdelatty, A Umar, AS Obeidat, E Enakerakpo, M Alhendi, MD Poliks IMAPSource Proceedings 2022 (1), 000507-000512, 2023 | 4 | 2023 |
| Damage Accumulation in Printed Interconnects on Flex Under Combinations of Bending and Tension With Different Amplitudes RS Sivasubramony, M Alhendi, MZ Kokash, M Yadav, A Raj, S Thekkut, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1225-1233, 2020 | 3 | 2020 |
| Methods of Printing Copper for PCB Repair DJ Richmond, E Enakerakpo, M Alhendi, P McClure, MD Poliks 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 2298-2304, 2022 | 2 | 2022 |
| High stability and reliability additively manufactured metal-insulator-metal capacitors for high-temperature applications F Alshatnawi, E Enakerakpo, M Alhendi, M Abdelatty, A Umar, ... Materials Today Communications 39, 108682, 2024 | 1 | 2024 |
| Passive UHF-RFID Tag With Printed Security Features for Authentication and Tamper Resistance E Enakerakpo, A Umar, M Alhendi, R Al-Haidari, DJ Richmond, ... IEEE Journal of Radio Frequency Identification, 2024 | 1 | 2024 |
| Modeling the effect of bend radius on the performance of a conformal dual-band mm-wave patch antenna array A Umar, MY Abdelatty, A Obeidat, E Enakerakpo, M Alhendi, MD Poliks IMAPSource Proceedings 2022 (1), 000094-000098, 2023 | 1 | 2023 |
| Performance of Flexible Microwave Antenna Under Environmental Stress E Enakerakpo, AI Umar, M Alhendi, D Richmond, MD Poliks, T Rovere, ... 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 1927-1933, 2022 | 1 | 2022 |
| Effect of Thermal & Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates AS Obeidat, E Enkerakpo, A Umar, W Al-Shaibani, M Abdelatty, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics WT Alshaibani, A Umar, F Alshatnawi, E Enakerakpo, MY Abdelatty, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1986-1992, 2024 | | 2024 |
| Direct-Write NiO RRAM Cells J Howard-Jennings, R Al-Haidari, E Enakerakpo, A Obeidat, K Bell, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 704-709, 2024 | | 2024 |
| Novel SiO2 Cables With Edge Launch Connectors for High Temperature RF Measurements F Alshatnawi, A Umar, E Enakerakpo, MY Abdelatty, WT Alshaibani, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1981-1985, 2024 | | 2024 |
| Empirical Model and Experimental Validation of Meshed Ground Impact on RF Performance of Flexible Microstrip Lines for Bending Applications MY Abdelatty, M Alhendi, AS Obeidat, A Umar, E Enakerakpo, ... IEEE Journal on Flexible Electronics, 2024 | | 2024 |
| Embedded PIN-Diode Die Interconnections with Aerosol-Jet Printing S Gonya, M Alhendi, E Enakerakpo, MD Poliks, T Rovere, J Jendrisak, ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
Mohammed A. AlhendiPhD, State University of New York at Binghamton在 binghamton.edu 的电子邮件经过验证
