| Full integration of a 3D demonstrator with TSV first interposer, ultra thin die stacking and wafer level packaging G Pares, C Karoui, A Zaid, F Dosseul, M Feron, A Attard, G Klug, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 305-306, 2013 | 17 | 2013 |
| Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si WZ Yao, F Roqueta, JC Craveur, S Belhenini, P Gardes, A Tougui Materials Research Express 5 (4), 046405, 2018 | 15 | 2018 |
| Conducted EMI prediction in DC/DC converter using frequency domain approach B Nassireddine, B Abdelber, C Nawel, D Abdelkader, B Soufyane 2018 International Conference on Electrical Sciences and Technologies in …, 2018 | 9 | 2018 |
| Elastic modulus measurements of vertically aligned multi walled carbon nanotubes carpets by using the nanoindentation technique S Belhenini, T Labbaye, C Boulmer-Leborgne, E Kovacevic, A Tougui, ... Mechanics Research Communications 85, 16-20, 2017 | 7 | 2017 |
| 3D FEM simulations of drop test reliability on 3D-WLP: effects of solder reflow residual stress and molding resin parameters S Belhenini, A Tougui, A Bouchou, R Mohan, F Dosseul Journal of electronic materials 43, 708-716, 2014 | 7 | 2014 |
| Intrinsic stress effects on the warpage of silicon substrate during thin film deposition, photolithography and etching processes WZ Yao, S Belhenini, F Roqueta, C Pujos, E Bruno, P Gardes, A Tougui 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 6 | 2016 |
| 3D finite element modeling of 3D C2W (chip to wafer) drop test reliability: Optimization of internal architecture and materials S Belhenini, A Tougui, A Bouchou, F Dosseul Microelectronics Reliability 54 (1), 13-21, 2014 | 6 | 2014 |
| Etude de structures de composants Micro-Électroniques innovants (3D): caractérisation, modélisation et fiabilité des démonstrateurs 3D sous sollicitations mécaniques et … S Belhenini Tours, 2013 | 3 | 2013 |
| Contribution to the Study of Solid-Solid Thermal Contact Resistances--A Comparative Study R Cheriet, B Bensaad, F Bouhadjela, S Belhenini, M Belharizi | 2 | 2021 |
| Contribution to the study of plastic mechanics models of solid-solid contacts F Bouhadjela, B Bensaad, R Cheriet, M Belharizi, S Belhenini Annales de Chimie-Science des Matériaux Vol. 44, No. 1, February, 2020, pp …, 2020 | 2 | 2020 |
| Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact S Belhenini, I El Fatmi, C Richard, A Tougui Soldering & Surface Mount Technology, 2023 | 1 | 2023 |
| Implementation of the Homogenization Method in the Numerical Estimation of Wafer Warpage S Belhenini, I El Fatmi, C Richard, A Tougui, F Roqueta Coatings 13 (2), 318, 2023 | 1 | 2023 |
| Buck Converter Common-Mode Emission with the Frequency Approach N BENHADDA, A BENDAOUD, M MILOUDI, B BENAZZA, S BELHENINI International Journal of Electronics and Electrical Engineering Systems, 2020 | 1 | 2020 |
| Étude de structures de composants microélectroniques innovants (3D) S BELHENINI | 1 | 2013 |
| 3-D finite elements simulation of drop test reliability on a Chip Scale Package: focus on the component architecture and materials S Belhenini, A Bouchou, F Dosseul, A Tougui 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 1 | 2012 |
| Energy density estimation of crack initiation in Sn-Ag-Cu (Ni) solder by nano-impact Z Ma, S Belhenini, F Chalon, R Leroy, N Ranganathan, F Dosseul Fiabilité Mécanique des Composants Electroniques (FMCE 2012), 2012 | 1 | 2012 |
| Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents A Mecellem, S Belhenini, D Khelladi, C Richard Microelectronics International 41 (3), 172-178, 2024 | | 2024 |
| Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications I El Fatmi, S Belhenini, A Tougui Microelectronics International 41 (2), 96-102, 2023 | | 2023 |
| Matériaux Composites Notes de cours BELHENINISoufyane DOI: 10.13140/RG.2.2.25769.47204, 2023 | | 2023 |
| Conducted Differential-Mode Emission from Buck Converter N BENHADDA, A BENDAOUD, M MILOUDI, B BENAZZA, S BELHENINI International Journal of Electronics and Electrical Engineering Systems, 2021 | | 2021 |
