| Interfacial reactions between lead-free solders and common base materials T Laurila, V Vuorinen, JK Kivilahti Materials Science and Engineering: R: Reports 49 (1-2), 1-60, 2005 | 1240 | 2005 |
| Thermodynamics, diffusion and the Kirkendall effect in solids A Paul, T Laurila, V Vuorinen, SV Divinski Springer International Publishing, 2014 | 424 | 2014 |
| Impurity and alloying effects on interfacial reaction layers in Pb-free soldering T Laurila, V Vuorinen, M Paulasto-Kröckel Materials Science and Engineering: R: Reports 68 (1-2), 1-38, 2010 | 369 | 2010 |
| Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn–Cu intermetallic compound layers T Laurila, J Hurtig, V Vuorinen, JK Kivilahti Microelectronics Reliability 49 (3), 242-247, 2009 | 126 | 2009 |
| Interfacial reactions between lead-free SnAgCu solder and Ni (P) surface finish on printed circuit boards K Zeng, V Vuorinen, JK Kivilahti IEEE Transactions on Electronics Packaging Manufacturing 25 (3), 162-167, 2002 | 125 | 2002 |
| Formation of Intermetallic Compounds Between Liquid Sn and Various CuNi x Metallizations V Vuorinen, H Yu, T Laurila, JK Kivilahti Journal of Electronic Materials 37, 792-805, 2008 | 110 | 2008 |
| Impact of printed wiring board coatings on the reliability of lead-free chip-scale package interconnections TT Mattila, V Vuorinen, JK Kivilahti Journal of materials research 19, 3214-3223, 2004 | 107 | 2004 |
| Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests T Laurila, T Mattila, V Vuorinen, J Karppinen, J Li, M Sippola, JK Kivilahti Microelectronics Reliability 47 (7), 1135-1144, 2007 | 100 | 2007 |
| Solid-state reactions between Cu (Ni) alloys and Sn V Vuorinen, T Laurila, T Mattila, E Heikinheimo, JK Kivilahti Journal of Electronic Materials 36, 1355-1362, 2007 | 96 | 2007 |
| Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability M Broas, O Kanninen, V Vuorinen, M Tilli, M Paulasto-Kröckel ACS omega 2 (7), 3390-3398, 2017 | 69 | 2017 |
| Void formation and its impact on CuSn intermetallic compound formation G Ross, V Vuorinen, M Paulasto-Kröckel Journal of Alloys and Compounds 677, 127-138, 2016 | 64 | 2016 |
| Phase formation between lead-free Sn–Ag–Cu solder and Ni (P)∕ Au finishes V Vuorinen, T Laurila, H Yu, JK Kivilahti Journal of Applied Physics 99 (2), 2006 | 64 | 2006 |
| Fick’s laws of diffusion A Paul, T Laurila, V Vuorinen, SV Divinski, A Paul, T Laurila, V Vuorinen, ... Thermodynamics, diffusion and the kirkendall effect in solids, 115-139, 2014 | 63 | 2014 |
| Mining attribute-based access control policies from RBAC policies Z Xu, SD Stoller 2013 10th International Conference and Expo on Emerging Technologies for a …, 2013 | 54 | 2013 |
| Effect of dissolution and intermetallic formation on the reliability of FC joints K Kulojärvi, V Vuorinen, J Kivilahti Microelectronics international 15 (2), 20-24, 1998 | 52 | 1998 |
| Solder/substrate interfacial reactions in the Sn-Cu-Ni interconnection system H Yu, V Vuorinen, JK Kivilahti Journal of electronic materials 36, 136-146, 2007 | 51 | 2007 |
| Wafer-level SLID bonding for MEMS encapsulation H Xu, T Suni, V Vuorinen, J Li, H Heikkinen, P Monnoyer, ... Advances in manufacturing 1, 226-235, 2013 | 48 | 2013 |
| Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders T Laurila, V Vuorinen, T Mattila, JK Kivilahti Journal of electronic materials 34, 103-111, 2005 | 47 | 2005 |
| Diffusion and growth mechanism of Nb3Sn superconductor grown by bronze technique T Laurila, V Vuorinen, AK Kumar, A Paul Applied Physics Letters 96 (23), 2010 | 40 | 2010 |
| Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films M Broas, P Sippola, T Sajavaara, V Vuorinen, A Pyymaki Perros, ... Journal of vacuum science & technology A 34 (4), 2016 | 39 | 2016 |
Mikael BroasAalto University在 aalto.fi 的电子邮件经过验证
Mikael BroasAalto University在 aalto.fi 的电子邮件经过验证