| Highly sensitive, flexible, and wearable pressure sensor based on a giant piezocapacitive effect of three-dimensional microporous elastomeric dielectric layer D Kwon, TI Lee, J Shim, S Ryu, MS Kim, S Kim, TS Kim, I Park ACS applied materials & interfaces 8 (26), 16922-16931, 2016 | 489 | 2016 |
| Wearable, ultrawide-range, and bending-insensitive pressure sensor based on carbon nanotube network-coated porous elastomer sponges for human interface and healthcare devices S Kim, M Amjadi, TI Lee, Y Jeong, D Kwon, MS Kim, K Kim, TS Kim, ... ACS applied materials & interfaces 11 (26), 23639-23648, 2019 | 179 | 2019 |
| Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit MB Khan, DH Kim, JH Han, H Saif, H Lee, Y Lee, M Kim, E Jang, SK Hong, ... Nano Energy 58, 211-219, 2019 | 108 | 2019 |
| Hydrogel-laden paper scaffold system for origami-based tissue engineering SH Kim, HR Lee, SJ Yu, ME Han, DY Lee, SY Kim, HJ Ahn, MJ Han, ... Proceedings of the National Academy of Sciences 112 (50), 15426-15431, 2015 | 105 | 2015 |
| Wireless powered wearable micro light-emitting diodes HE Lee, D Lee, TI Lee, JH Shin, GM Choi, C Kim, SH Lee, JH Lee, ... Nano Energy 55, 454-462, 2019 | 102 | 2019 |
| Extremely robust and patternable electrodes for copy-paper-based electronics J Ahn, JW Seo, TI Lee, D Kwon, I Park, TS Kim, JY Lee ACS applied materials & interfaces 8 (29), 19031-19037, 2016 | 52 | 2016 |
| Contact-free thermal expansion measurement of very soft elastomers using digital image correlation TI Lee, MS Kim, TS Kim Polymer Testing 51, 181-189, 2016 | 49 | 2016 |
| Bending properties of anisotropic conductive films assembled chip-in-flex packages for wearable electronics applications JH Kim, TI Lee, JW Shin, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 39 | 2016 |
| An extended analytic model for the elastic properties of platelet-staggered composites and its application to 3D printed structures Y Kim, Y Kim, TI Lee, TS Kim, S Ryu Composite Structures 189, 27-36, 2018 | 37 | 2018 |
| Thermal expansion behavior of thin films expanding freely on water surface JH Kim, KL Jang, K Ahn, T Yoon, TI Lee, TS Kim Scientific reports 9 (1), 7071, 2019 | 34 | 2019 |
| Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer J Seo, C Kim, BS Ma, TI Lee, JH Bong, JG Oh, BJ Cho, TS Kim Advanced Functional Materials 28 (26), 1707102, 2018 | 34 | 2018 |
| Flexural and tensile moduli of flexible FR4 substrates TI Lee, C Kim, MS Kim, TS Kim Polymer Testing 53, 70-76, 2016 | 32 | 2016 |
| Warpage analysis of electroplated Cu films on fiber-reinforced polymer packaging substrates C Kim, TI Lee, MS Kim, TS Kim polymers 7 (6), 985-1004, 2015 | 31 | 2015 |
| Direct visualization of cross-sectional strain distribution in flexible devices TI Lee, W Jo, W Kim, JH Kim, KW Paik, TS Kim ACS applied materials & interfaces 11 (14), 13416-13422, 2019 | 29 | 2019 |
| Porous dielectric elastomer based ultra-sensitive capacitive pressure sensor and its application to wearable sensing device D Kwon, TI Lee, MS Kim, S Kim, TS Kim, I Park 2015 Transducers-2015 18th International Conference on Solid-State Sensors …, 2015 | 28 | 2015 |
| The effect of anisotropic conductive films adhesion on the bending reliability of chip-in-flex packages for wearable electronics applications JH Kim, TI Lee, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 26 | 2017 |
| Effects of the mechanical properties of polymer resin and the conductive ball types of anisotropic conductive films on the bending properties of chip-in-flex package YL Kim, TI Lee, JH Kim, W Kim, TS Kim, KW Paik IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (2 …, 2016 | 21 | 2016 |
| Facilitated embedding of silver nanowires into conformally-coated iCVD polymer films deposited on cloth for robust wearable electronics JW Seo, M Joo, J Ahn, TI Lee, TS Kim, SG Im, JY Lee Nanoscale 9 (10), 3399-3407, 2017 | 18 | 2017 |
| Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations JB Pyo, TI Lee, C Kim, MS Kim, TS Kim Soft matter 12 (18), 4135-4141, 2016 | 18 | 2016 |
| Ultra-thin chip-in-flex (CIF) technology using anisotropic conductive films (ACFs) for wearable electronics applications JH Kim, TI Lee, JW Shin, TS Kim, KW Paik 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 714-718, 2015 | 15 | 2015 |
