| Effect of aging on the high strain rate mechanical properties of SAC105 and SAC305 leadfree alloys P Lall, S Shantaram, J Suhling, D Locker 2013 IEEE 63rd Electronic Components and Technology Conference, 1277-1293, 2013 | 108 | 2013 |
| High speed digital image correlation for transient-shock reliability of electronics P Lall, D Panchagade, D Iyengar, S Shantaram, J Suhling, H Schrier 2007 Proceedings 57th Electronic Components and Technology Conference, 924-939, 2007 | 96 | 2007 |
| Design envelopes and optical feature extraction techniques for survivability of SnAg leadfree packaging architectures under shock and vibration P Lall, D Iyengar, S Shantaram, R Pandher, D Panchagade, J Suhling 2008 58th Electronic Components and Technology Conference, 1036-1047, 2008 | 91 | 2008 |
| Explicit submodeling and digital image correlation based life-prediction of leadfree electronics under shock-impact P Lall, S Shantaram, A Angral, M Kulkarni 2009 59th Electronic Components and Technology Conference, 542-555, 2009 | 78 | 2009 |
| Peridynamic-Models Using Finite Elements for Shock and Vibration Reliability of Lead-free Electronics Proceedings of ITHERM 2010 P Lall, S Shantaram, D Panchagade Las Vegas, NV, 2010 | 53* | 2010 |
| Peridynamic-models using finite elements for shock and vibration reliability of leadfree electronics P Lall, S Shantaram, D Panchagade 2010 12th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2010 | 53 | 2010 |
| S., Gupta, P., Panchagade, D., Suhling, J., KEYNOTE PRESENTATION: Feature Extraction and Health Monitoring using Image Correlation for Survivability of Leadfree Packaging under … P Lall, D Iyengar, S Shantaram Proceedings of the 9th International Conference on Thermal, Mechanical, and …, 2008 | 46 | 2008 |
| High strain rate mechanical properties of SAC105 leadfree alloy at high operating temperatures P Lall, V Yadav, D Zhang, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 41 | 2014 |
| Keynote Presentation: Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration P Lall, D Iyengar, SS Shantaram, P Gupta, D Panchagade, J Suhling Proceedings of the 9th International Conference on Thermal, Mechanical, and …, 2008 | 38 | 2008 |
| Material behavior of SAC305 under high strain rate at high temperature P Lall, D Zhang, V Yadav, J Suhling, S Shantaram Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 31 | 2014 |
| Mechanical deformation behavior of SAC305 at high strain rates P Lall, S Shantaram, J Suhling, D Locker 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012 | 31 | 2012 |
| Effect of high strain-rate on mechanical properties of SAC105 and SAC305 leadfree alloys P Lall, S Shantaram, J Suhling, D Locker 2012 IEEE 62nd Electronic Components and Technology Conference, 1312-1326, 2012 | 26 | 2012 |
| Stress–strain behavior of SAC305 at high strain rates P Lall, S Shantaram, J Suhling, D Locker Journal of Electronic Packaging 137 (1), 2015 | 22 | 2015 |
| Constitutive Behavior of SAC LeadFree Alloys at High Strain Rates P Lall, S Shantaram, M Kulkarni, G Limaye, J Suhling International Electronic Packaging Technical Conference and Exhibition 44618 …, 2011 | 21 | 2011 |
| High strain-rate mechanical properties of SnAgCu leadfree alloys P Lall, S Shantaram, M Kulkarni, G Limaye, J Suhling 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 684-700, 2011 | 10 | 2011 |
| Feature extraction and health monitoring using image correlation for survivability of leadfree packaging under shock and vibration P Lall, D Iyengar, S Shantaram, P Gupta, D Panchagade, J Suhling EuroSimE 2008-International Conference on Thermal, Mechanical and Multi …, 2008 | 10 | 2008 |
| Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot P Lall, G Limaye, S Shantaram, J Suhling International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013 | 8 | 2013 |
| Delamination-induced stitch crack of copper wires M Van Soestbergen, A Mavinkurve, S Shantaram, JJM Zaal 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 7 | 2017 |
| High strain rate properties of sac105 and sac305 leadfree alloys after extended high temperature storage P Lall, S Shantaram, D Locker Journal of the SMTA 27 (1), 13-27, 2014 | 7 | 2014 |
| Methodology for Predicting BGA Warpage by Incorporating Metal Layer Design S Shantaram, T Hauck International Symposium on Microelectronics 2014 (1), 000037-000043, 2014 | 6 | 2014 |
