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Jack Knoll
Jack Knoll
Direct PhD Student, Virginia Tech
在 vt.edu 的电子邮件经过验证 - 首页
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引用次数
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Low Thermal Resistance (0.5 K/W) Ga₂O₃ Schottky Rectifiers With Double-Side Packaging
B Wang, M Xiao, J Knoll, C Buttay, K Sasaki, GQ Lu, C DiMarino, Y Zhang
IEEE Electron Device Letters 42 (8), 1132-1135, 2021
392021
A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter
JS Knoll, G Son, C DiMarino, Q Li, H Stahr, M Morianz
IEEE Transactions on Power Electronics 37 (10), 11927-11936, 2022
172022
Design and Analysis of a PCB-Embedded 1.2 kV SiC Half-Bridge Module
J Knoll, G Son, C DiMarino, Q Li, H Stahr, M Morianz
2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5240-5246, 2021
122021
Thermal Dissipation Approach Comparison and Evaluation for SiC Surface Mount Devices
V Baker, B Fan, J Knoll, R Burgos, W Chen
2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5670-5676, 2021
52021
1.2 kV SiC MOSFET Full-Bridge Power Module with Integrated Gate Driver and Coupled Inductor
J Knoll, J Miranda-Santos, X Chen, C DiMarino, Q Li
2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022
42022
How to Achieve Low Thermal Resistance and High Electrothermal Ruggedness in Ga2O3 Devices?
Y Zhang, B Wang, M Xiao, J Spencer, R Zhang, J Knoll, C DiMarino, ...
ECS Transactions 104 (5), 21, 2021
42021
Characterization of 4.5 kV Charge-Balanced SiC MOSFETs
J Knoll, M Shawky, SH Yen, I Eshera, C DiMarino, R Ghandi, S Kennerly, ...
2021 IEEE Applied Power Electronics Conference and Exposition (APEC), 2217-2223, 2021
42021
A Guide for Accurate and Repeatable Measurement of the RTH, JC of SiC Packages
J Knoll, C DiMarino, C Buttay
2022 IEEE Energy Conversion Congress and Exposition (ECCE), 1-7, 2022
22022
Considerations for Mitigating False Triggering of a Truly Differential Input Gate Driver for 1.2 kV SiC MOSFETs
J Miranda-Santos, J Knoll, X Chen, C DiMarino, Q Li
PCIM Europe 2023; International Exhibition and Conference for Power …, 2023
12023
A PCB-Embedded 1.2 kV SiC MOSFET Package with Reduced Manufacturing Complexity
J Knoll, C DiMarino, H Stahr, M Morianz
IEEE Open Journal of Power Electronics, 2023
2023
PCB-Based 1.2 kV SiC MOSFET Packages for High Power Density Electric Vehicle On-Board Chargers
J Knoll
Virginia Tech, 2022
2022
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