| High efficiency polymer based direct multi-jet impingement cooling solution for high power devices Tiwei Wei, Herman Oprins, Vladimir Cherman, Jun Qian ,Ingrid De wolf, Eric ... IEEE Transactions on Power Electronics, 1 - 1, 2018 | 57* | 2018 |
| High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler W Tiwei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ... 2017 IEEE International Electron Devices Meeting (IEDM), 2017 | 40 | 2017 |
| Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip T Wei, H Oprins, V Cherman, ... Applied Thermal Engineering 152 (https://doi.org/10.1016/j.applthermaleng …, 2019 | 38 | 2019 |
| Experimental and Numerical Investigation of Direct Liquid Jet Impinging Cooling using 3D Printed Manifolds on Lidded and Lidless Packages for 2.5D Integrated Systems Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans Applied Thermal Engineering, 2019 | 37* | 2019 |
| All-in-one design integrates microfluidic cooling into electronic chips T Wei Nature, 188-189, 2020 | 32 | 2020 |
| Low-cost Energy Efficient On-chip Hotspot Targeted Microjet Cooling for High Power Electronics Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans IEEE Transactions on Components, Packaging and Manufacturing Technology, 1 - 1, 2019 | 28* | 2019 |
| Experimental Characterization of a Chip Level 3D Printed Microjet Liquid Impingement Cooler for High Performance Systems Tiwei Wei, Herman Oprins, Vladimir Cherman, Shoufeng Yang, Ingrid De wolf ... IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019 | 24 | 2019 |
| Optimization and evaluation of sputtering barrier/seed layer in through silicon via for 3-D integration [J] T Wei, J Cai, Q Wang, Y Hu, L Wang, Z Liu, Z Wu Tsinghua Science and Technology 19 (2), 150-160, 2014 | 24 | 2014 |
| 3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges TW Wei, H Oprins, V Cherman, I De Wolf, E Beyne, S Yang, M Baelmans 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2389-2396, 2018 | 23 | 2018 |
| Conjugate Heat Transfer and Fluid Flow Modeling for Liquid Microjet Impingement Cooling with Alternating Feeding and Draining Channels Tiwei Wei, Herman Oprins, Vladimir Cherman, Eric Beyne, Matine Baelmans Fluids 4 (3), 145, 2019 | 19 | 2019 |
| Feasibility Design of Tight Integration of Low Inductance SiC Power Module with Microchannel Cooler H Chen, TW Wei, Y Chen, X Li, N Li, Q Zhu, S Hazra, Y Zhao, MP Gupta, ... 2022 IEEE Applied Power Electronics Conference and Exposition (APEC), 962-965, 2022 | 17 | 2022 |
| Nozzle Scaling Effects for the Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns TW Wei, H Oprins, L Fang, V Cherman, ID Wolf, E Beyne, M Baelmans Applied Thermal Engineering, 2020 | 17 | 2020 |
| Performance and reliability study of TGV interposer in 3D integration T Wei, Q Wang, J Cai, L Chen, J Huang, L Wang, L Zhang, C Li 2014 IEEE 16th electronics packaging technology conference (EPTC), 601-605, 2014 | 17 | 2014 |
| Numerical Study of Large Footprint (24× 24mm2) Silicon-Based Embedded Microchannel 3D Manifold Coolers T Wei, S Hazra, Y Lin, MP Gupta, M Degner, M Asheghi, EK Goodson Journal of Electronic Packaging 145 (2), 021008, 2023 | 15 | 2023 |
| Parametric design analysis of a multi-level 3D manifolded microchannel cooler via reduced order numerical modeling S Hazra, T Wei, Y Lin, M Asheghi, K Goodson, MP Gupta, M Degner International Journal of Heat and Mass Transfer 197, 123356, 2022 | 14 | 2022 |
| Experimental and numerical study of 3-D printed direct jet impingement cooling for high-power, large die size applications T Wei, H Oprins, V Cherman, Z Yang, KC Rivera, G Van der Plas, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 14 | 2020 |
| Heat Transfer and Pressure Drop Correlations for Direct on-Chip Microscale jet impingement Cooling with Alternating Feeding and Draining Jets T Wei, H Oprins, LiangFang, V Cherman, E Beyne, M Baelmans International Journal of Heat and Mass Transfer 182, 2021 | 11 | 2021 |
| Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications TW Wei, H Oprins, V Cherman, Z Yang, K Rivera, GV der Plas, BJ Pawlak, ... Electronic Components and Technology Conference (ECTC), 2020 | 11 | 2020 |
| Wafer level bumping technology for high voltage LED packaging T Wei, X Qiu, JCC Lo, SWR Lee 2015 10th International Microsystems, Packaging, Assembly and Circuits …, 2015 | 11 | 2015 |
| Copper filling process for small diameter, high aspect ratio through silicon via (TSV) T Wei, J Cai, Q Wang, Z Liu, Y Li, T Wang, D Wang Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 …, 2012 | 11 | 2012 |
Herman OprinsIMEC在 imec.be 的电子邮件经过验证
