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Jingwei Xian
Jingwei Xian
在 dlut.edu.cn 的电子邮件经过验证 - 首页
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引用次数
引用次数
年份
Cu6Sn5 crystal growth mechanisms during solidification of electronic interconnections
JW Xian, SA Belyakov, M Ollivier, K Nogita, H Yasuda, CM Gourlay
Acta Materialia 126, 540-551, 2017
1022017
Nucleation of tin on the Cu6Sn5 layer in electronic interconnections
JW Xian, ZL Ma, SA Belyakov, M Ollivier, CM Gourlay
Acta Materialia 123, 404-415, 2017
772017
Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn
JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay
Intermetallics 91, 50-64, 2017
712017
Nucleation and growth crystallography of Al8Mn5 on B2-Al (Mn, Fe) in AZ91 magnesium alloys
G Zeng, JW Xian, CM Gourlay
Acta Materialia 153, 364-376, 2018
692018
Nucleation and growth of tin in Pb-free solder joints
CM Gourlay, SA Belyakov, ZL Ma, JW Xian
Jom 67, 2383-2393, 2015
632015
Heterogeneous nucleation of Cu6Sn5 in Sn–Cu–Al solders
JW Xian, SA Belyakov, TB Britton, CM Gourlay
Journal of Alloys and Compounds 619, 345-355, 2015
592015
In situ imaging of microstructure formation in electronic interconnections
MAAM Salleh, CM Gourlay, JW Xian, SA Belyakov, H Yasuda, ...
Scientific reports 7 (1), 40010, 2017
552017
Influence of bismuth on the solidification of Sn-0.7 Cu-0.05 Ni-xBi/Cu joints
SA Belyakov, JW Xian, K Sweatman, T Nishimura, T Akaiwa, CM Gourlay
Journal of Alloys and Compounds 701, 321-334, 2017
512017
Nucleation and twinning in tin droplet solidification on single crystal intermetallic compounds
ZL Ma, JW Xian, SA Belyakov, CM Gourlay
Acta Materialia 150, 281-294, 2018
492018
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Y Xu, J Xian, S Stoyanov, C Bailey, RJ Coyle, CM Gourlay, FPE Dunne
International Journal of Plasticity 155, 103308, 2022
402022
Precipitation and coarsening of bismuth plates in Sn–Ag–Cu–Bi and Sn–Cu–Ni–Bi solder joints
SA Belyakov, J Xian, G Zeng, K Sweatman, T Nishimura, T Akaiwa, ...
Journal of Materials Science: Materials in Electronics 30, 378-390, 2019
332019
Influence of Ni on the refinement and twinning of primary Cu6Sn5 in Sn-0.7 Cu-0.05 Ni
JW Xian, MAAM Salleh, SA Belyakov, TC Su, G Zeng, K Nogita, H Yasuda, ...
Intermetallics 102, 34-45, 2018
332018
Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
Y Cui, JW Xian, A Zois, K Marquardt, H Yasuda, CM Gourlay
Acta Materialia 249, 118831, 2023
292023
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5 Cu solder
Y Xu, T Gu, J Xian, F Giuliani, TB Britton, CM Gourlay, FPE Dunne
International Journal of Plasticity 137, 102904, 2021
272021
Controlling Bulk Cu6Sn5 Nucleation in Sn0. 7Cu/Cu Joints with Al Micro-alloying
JW Xian, SA Belyakov, CM Gourlay
Journal of Electronic Materials 45 (1), 69, 2016
262016
Al11Mn4 formation on Al8Mn5 during the solidification and heat treatment of AZ-series magnesium alloys
JW Xian, L Peng, G Zeng, D Wang, CM Gourlay
Materialia 19, 101192, 2021
182021
Microstructure and damage evolution during thermal cycling of Sn-Ag-Cu solders containing antimony
SA Belyakov, RJ Coyle, B Arfaei, JW Xian, CM Gourlay
Journal of Electronic Materials 50, 825-841, 2021
172021
Time-Lapse Imaging of Ag3Sn Thermal Coarsening in Sn-3Ag-0.5Cu Solder Joints
JW Xian, SA Belyakov, CM Gourlay
Journal of Electronic Materials 50, 786-795, 2021
172021
Al–Mn–Fe intermetallic formation in AZ91 magnesium alloys: Effects of impurity iron
L Peng, G Zeng, J Xian, CM Gourlay
Intermetallics 142, 107465, 2022
162022
The Influence of Primary Cu6Sn5 Size on the Shear Impact Properties of Sn-Cu/Cu BGA Joints
ZQ Li, SA Belyakov, JW Xian, CM Gourlay
Journal of Electronic Materials 47, 84-95, 2018
142018
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