| Shear strength and wettability of active Sn3. 5Ag4Ti (Ce, Ga) solder on Al2O3 ceramics R Koleňák, P Šebo, M Provazník, M Koleňáková, K Ulrich Materials & Design 32 (7), 3997-4003, 2011 | 89 | 2011 |
| Wettability and shear strength of active Sn2Ti solder on Al2O3 ceramics R Koleňák, M Chachula, P Šebo, M Koleňáková Soldering & surface mount technology 23 (4), 224-228, 2011 | 29 | 2011 |
| Soldering of copper with high-temperature Zn-based solders M Prach, R Koleňák Procedia Engineering 100, 1370-1375, 2015 | 23 | 2015 |
| Characterizing the soldering alloy type In–Ag–Ti and the study of direct soldering of SiC ceramics and copper R Koleňák, I Kostolný, J Drápala, M Sahul, J Urminský Metals 8 (4), 274, 2018 | 18 | 2018 |
| Study of direct bonding ceramics with metal using Sn2La solder R Koleňák, I Kostolný Advances in Materials Science and Engineering 2015 (1), 269167, 2015 | 18 | 2015 |
| Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder R Koleňák, I Kostolný, J Drápala, M Kusý, M Pašák Soldering & Surface Mount Technology 31 (2), 93-101, 2019 | 16 | 2019 |
| Characteristics and properties of Bi‐11Ag solder R Koleňák, M Chachula Soldering & Surface Mount Technology 25 (2), 68-75, 2013 | 15 | 2013 |
| Comparison study of SAC405 and SAC405+ 0.1% Al lead free solders R Koleňák, R Augustin, M Martinkovič, M Chachula Soldering & Surface Mount Technology 25 (3), 175-183, 2013 | 14 | 2013 |
| Characterization of soldering alloy type Zn-In-Mg and the study of direct soldering of silicon and copper R Koleňák, I Kostolný, M Kusý Materials Science and Engineering: A 712, 302-312, 2018 | 13 | 2018 |
| Research of fluxless soldering of high-purity aluminium with solders type Zn-Al R Koleňák, I Kostolný, R Čička Advanced Materials Research 905, 132-136, 2014 | 13 | 2014 |
| Solderability of metal and ceramic materials by active solders R Koleňák Forschungszentrum Dresden, 2008 | 13 | 2008 |
| Research on joining metal-ceramics composite Al/Al2O3 with Cu substrate using solder type Zn–In–Mg R Koleňák, I Kostolný, J Drápala, M Drienovský, M Sahul Journal of Composite Materials 53 (10), 1411-1422, 2019 | 11 | 2019 |
| Research of joining brittle nonmetallic materials with an active solder R Koleňák, M Prach Advances in Materials Science and Engineering 2014 (1), 729135, 2014 | 11 | 2014 |
| Research of joining graphite by use of active solder R Koleňák, M Prach Advanced Materials Research 875, 1270-1274, 2014 | 8 | 2014 |
| Shear strength and DSC analysis of high-temperature solders R Koleňák, M Martinkovič, M Koleňáková Archives of Metallurgy and Materials, 2013 | 8 | 2013 |
| Investigation of ultrasound-assisted soldering of SiC ceramics by Zn-Al-In high-temperature solder I Kostolný, R Koleňák, E Hodúlová, P Zacková, M Kusý Welding in the World 63, 1449-1459, 2019 | 7* | 2019 |
| A Study of the Interface of Soldered Joints of SnInAgTi Active Solder with Ito Ceramics M Provazník, R Koleňák Acta Polytechnica 50 (6), 2010 | 6 | 2010 |
| Fluxless ultrasonic soldering of SiC ceramics and Cu by Bi–Ag–Ti based solder D Šuryová, I Kostolný, R Koleňák AIMS Materials Science 7 (1), 24-32, 2020 | 5 | 2020 |
| Skúšanie zvarových spojov K Ulrich, R Koleňák, S Karvanská Slovenská technická univerzita, 2006 | 5 | 2006 |
| Ultrasonic soldering of Cu AND Al2O3 ceramics by use of Bi-La and Bi-Ag-La solders R Koleňák, M Prach, I Kostolný Acta Polytechnica 56 (2), 126-131, 2016 | 4 | 2016 |
