Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) L Codecasa, V d'Alessandro, A Magnani, N Rinaldi, PJ Zampardi 20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014 | 96 | 2014 |
Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach L Codecasa, V d’Alessandro, A Magnani, A Irace IEEE Transactions on Power Electronics 31 (8), 5906-5916, 2015 | 75 | 2015 |
SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs V d'Alessandro, A Magnani, M Riccio, G Breglio, A Irace, A Castellazzi IEEE 26th International Symposium on Power Semiconductor Devices and ICs …, 2014 | 51 | 2014 |
Matrix reduction tool for creating boundary condition independent dynamic compact thermal models L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 47 | 2015 |
On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction F Di Napoli, A Magnani, M Coppola, P Guerriero, V D’Alessandro, ... Energies 10 (2), 189, 2017 | 43 | 2017 |
Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology L Codecasa, V d’Alessandro, A Magnani, N Rinaldi IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 34 | 2014 |
Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations V d’Alessandro, A Magnani, M Riccio, Y Iwahashi, G Breglio, N Rinaldi, ... Microelectronics reliability 53 (9-11), 1713-1718, 2013 | 34 | 2013 |
Delphi-like dynamical compact thermal models using model order reduction B Rogié, L Codecasa, E Monier-Vinard, V Bissuel, N Laraqi, O Daniel, ... 2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017 | 33 | 2017 |
Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool A Magnani, V d'Alessandro, L Codecasa, PJ Zampardi, B Moser, ... Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE, 1-4, 2014 | 29 | 2014 |
Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources L Codecasa, A Magnani, V d'Alessandro, N Rinaldi, AG Metzger, ... 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 28 | 2016 |
Advanced thermal simulation of SiGe: C HBTs including back-end-of-line V d'Alessandro, A Magnani, L Codecasa, N Rinaldi, K Aufinger Microelectronics Reliability 67, 38-45, 2016 | 27 | 2016 |
Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level A Magnani, F Di Napoli, M Riccio, P Guerriero, V d'Alessandro, G Breglio, ... 2016 28th International Symposium on Power Semiconductor Devices and ICs …, 2016 | 27 | 2016 |
Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies V d'Alessandro, AP Catalano, A Magnani, L Codecasa, N Rinaldi, ... Microelectronics Reliability 78, 233-242, 2017 | 25 | 2017 |
Parametric compact thermal models by moment matching for variable geometry L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014 | 25 | 2014 |
Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction L Codecasa, A Magnani, N Rinaldi Microelectronics Journal 46 (12), 1129-1137, 2015 | 24 | 2015 |
Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 23 | 2015 |
Integration of 650 V GaN Power ICs on 200 mm Engineered Substrates X Li, K Geens, D Wellekens, M Zhao, A Magnani, N Amirifar, B Bakeroot, ... IEEE Transactions on Semiconductor Manufacturing 33 (4), 534-538, 2020 | 22 | 2020 |
Dynamic electrothermal macromodeling: an application to signal integrity analysis in highly integrated electronic systems V d'Alessandro, M de Magistris, A Magnani, N Rinaldi, S Russo IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 21 | 2013 |
Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology L Codecasa, V d’Alessandro, A Magnani, N Rinaldi IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2017 | 20 | 2017 |
Calibration of detailed thermal models by parametric dynamic compact thermal models L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 2016 22nd International Workshop on Thermal Investigations of ICs and …, 2016 | 18 | 2016 |