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Cher Ming Tan
Cher Ming Tan
Professor of Electronics Department, Chang Gung University
在 ieee.org 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
Effect of temperature on the aging rate of Li ion battery operating above room temperature
F Leng, CM Tan, M Pecht
Scientific reports 5 (1), 12967, 2015
5552015
Electromigration in ULSI interconnects
CM Tan, A Roy
Materials Science and Engineering: R: Reports 58 (1-2), 1-75, 2007
2882007
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy
S Liu, AK Ng, R Xu, J Wei, CM Tan, Y Yang, Y Chen
Nanoscale 2 (12), 2744-2750, 2010
2062010
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc
ZH Gan, GQ Yu, BK Tay, CM Tan, ZW Zhao, YQ Fu
Journal of physics d: applied physics 37 (1), 81, 2003
2032003
Electrowetting control of Cassie-to-Wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites
Z Han, B Tay, C Tan, M Shakerzadeh, K Ostrikov
ACS nano 3 (10), 3031-3036, 2009
1432009
Aligned carbon nanotubes for through-wafer interconnects
T Xu, Z Wang, J Miao, X Chen, CM Tan
Applied Physics Letters 91 (4), 2007
1272007
Size, temperature, and bond nature dependence of elasticity and its derivatives on extensibility, Debye temperature, and heat capacity of nanostructures
MX Gu, CQ Sun, Z Chen, TC Au Yeung, S Li, CM Tan, V Nosik
Physical Review B—Condensed Matter and Materials Physics 75 (12), 125403, 2007
1202007
FTIR spectroscopy as a tool for nano-material characterization
C Baudot, CM Tan, JC Kong
Infrared Physics & Technology 53 (6), 434-438, 2010
1182010
A framework to practical predictive maintenance modeling for multi-state systems
CM Tan, N Raghavan
Reliability Engineering & System Safety 93 (8), 1138-1150, 2008
1172008
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling
MD Le, CM Tan
Reliability Engineering & System Safety 113, 21-29, 2013
1112013
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
YD Han, SML Nai, HY Jing, LY Xu, CM Tan, J Wei
Journal of Materials Science: Materials in Electronics 22, 315-322, 2011
942011
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Intermetallics 31, 72-78, 2012
892012
Degradation physics of high power LEDs in outdoor environment and the role of phosphor in the degradation process
P Singh, CM Tan
Scientific reports 6 (1), 24052, 2016
862016
A reliability-based design concept for lithium-ion battery pack in electric vehicles
Z Liu, CM Tan, F Leng
Reliability Engineering & System Safety 134, 169-177, 2015
842015
Simulated annealing
CM Tan
BoD–Books on Demand, 2008
832008
Electromigration performance of Through Silicon Via (TSV)–A modeling approach
YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu
Microelectronics Reliability 50 (9-11), 1336-1340, 2010
822010
Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Journal of Electronic Materials 39, 223-229, 2010
812010
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
CM Tan, A Roy
Thin Solid Films 504 (1-2), 288-293, 2006
742006
Revisit to the finite element modeling of electromigration for narrow interconnects
CM Tan, Y Hou, W Li
Journal of Applied Physics 102 (3), 2007
722007
Customer‐focused build‐in reliability: a case study
C Ming Tan
International Journal of Quality & Reliability Management 20 (3), 378-397, 2003
712003
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