| Three-objective shape optimization and parametric study of a micro-channel heat sink with discrete non-uniform heat flux boundary conditions Y Hadad, B Ramakrishnan, R Pejman, S Rangarajan, PR Chiarot, ... Applied Thermal Engineering 150, 720-737, 2019 | 65 | 2019 |
| Cost-efficient overclocking in immersion-cooled datacenters M Jalili, I Manousakis, Í Goiri, PA Misra, A Raniwala, H Alissa, ... 2021 ACM/IEEE 48th Annual International Symposium on Computer Architecture …, 2021 | 48 | 2021 |
| Hybrid microchannel/multi-jet two-phase heat sink: A benchmark and geometry optimization study of commercial product CH Hoang, S Rangarajan, S Khalili, B Ramakrisnan, V Radmard, ... International Journal of Heat and Mass Transfer 169, 120920, 2021 | 45 | 2021 |
| Thermal analysis of cold plate for direct liquid cooling of high performance servers B Ramakrishnan, Y Hadad, S Alkharabsheh, PR Chiarot, B Sammakia Journal of Electronic Packaging 141 (4), 041005, 2019 | 40 | 2019 |
| CPU overclocking: A performance assessment of air, cold plates, and two-phase immersion cooling B Ramakrishnan, H Alissa, I Manousakis, R Lankston, R Bianchini, W Kim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 36 | 2021 |
| Performance analysis and shape optimization of a water-cooled impingement micro-channel heat sink including manifolds Y Hadad, S Rangararajan, K Nemati, B Ramakrishnann, R Pejman, ... International Journal of Thermal Sciences 148, 106145, 2020 | 36 | 2020 |
| Geometric optimization of an impinging cold-plate with a trapezoidal groove used for warm water cooling Y Hadad, R Pejman, B Ramakrishnan, PR Chiarot, BG Sammakia 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 26 | 2018 |
| An experimental apparatus for two-phase cooling of high heat flux application using an impinging cold plate and dielectric coolant CH Hoang, S Khalili, B Ramakrisnan, S Rangarajan, Y Hadad, ... 2020 36th Semiconductor Thermal Measurement, Modeling & Management Symposium …, 2020 | 24 | 2020 |
| Effect of system and operational parameters on the performance of an immersion-cooled multichip module for high performance computing B Ramakrishnan, SH Bhavnani, J Gess, RW Knight, D Harris, ... 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 20 | 2014 |
| Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model J Gess, S Bhavnani, B Ramakrishnan, RW Johnson, D Harris, RW Knight, ... Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014 | 18 | 2014 |
| Experimental characterization of two-phase cold plates intended for high-density data center servers using a dielectric fluid B Ramakrishnan, CH Hoang, S Khalili, Y Hadad, S Rangarajan, ... Journal of Electronic Packaging 143 (2), 020904, 2021 | 16 | 2021 |
| Failure analysis of direct liquid cooling system in data centers S Alkharabsheh, ULN Puvvadi, B Ramakrishnan, K Ghose, B Sammakia Journal of Electronic Packaging 140 (2), 020902, 2018 | 16 | 2018 |
| Experimental Characterization of Cold Plates used in Cooling Multi Chip Server Modules (MCM) B Ramakrishnan, Y Hadad, S Alkharabsheh, PR Chiarot, K Ghose, ... 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2018 | 16 | 2018 |
| Integrated silicon microfluidic cooling of a high-power overclocked CPU for efficient thermal management SK Rajan, B Ramakrishnan, H Alissa, W Kim, C Belady, MS Bakir IEEE Access 10, 59259-59269, 2022 | 14 | 2022 |
| Pressure drop analysis of direct liquid cooled (DLC) rack S Alkharabsheh, B Ramakrishnan, B Sammakia 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 14 | 2017 |
| Liquid cooling utilizing a hybrid microchannel/multi-jet heat sink: A component level study of commercial product CH Hoang, M Tradat, Y Manaserh, B Ramakrisnan, S Rangarajan, ... International Electronic Packaging Technical Conference and Exhibition 84041 …, 2020 | 13 | 2020 |
| Experimental investigation of direct liquid cooling of a two-die package B Ramakrishnan, S Alkharabsheh, Y Hadad, PR Chiarot, K Ghose, ... 2018 34th Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2018 | 13 | 2018 |
| Investigation and characterization of a high performance, small form factor, modular liquid immersion cooled server model J Gess, S Bhavnani, B Ramakrishnan, RW Johnson, D Harris, R Knight, ... 2014 Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM …, 2014 | 13 | 2014 |
| Numerical modeling and optimization of a V-groove warm water cold-plate Y Hadad, B Ramakrishnan, S Alkharabsheh, PR Chiarot, B Sammakia 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017 | 11 | 2017 |
| Experimental characterization of a cold plate used in warm water cooling of data centers B Ramakrishnan, S Alkharabsheh, Y Hadad, B Sammakia, PR Chiarot, ... 2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2017 | 9 | 2017 |
Bahgat G SammakiaBinghamton University在 binghamton.edu 的电子邮件经过验证
