| Insertion mechanics of amorphous SiC ultra-micro scale neural probes N Geramifard, B Dousti, C Nguyen, J Abbott, SF Cogan, VD Varner Journal of neural engineering 19 (2), 026033, 2022 | 17 | 2022 |
| Evaluation of Amorphous Silicon Carbide on Utah Electrode Arrays by Thermal Accelerated Aging* CK Nguyen, JR Abbott, S Negi, SF Cogan 2021 43rd Annual International Conference of the IEEE Engineering in …, 2021 | 4 | 2021 |
| Flexible and Extensible Ribbon-Cable Interconnects for Implantable Electrical Neural Interfaces N Geramifard, M Khajehzadeh, B Dousti, JR Abbott, CK Nguyen, ... ACS Applied Materials & Interfaces 16 (45), 61621-61632, 2024 | 1 | 2024 |
| Increasing the Lifetime of the Implantable Neural Devices CK Nguyen, B Srikanthan, R Bhandari, SF Cogan, S Negi 2022 International Electron Devices Meeting (IEDM), 29.7. 1-29.7. 4, 2022 | 1 | 2022 |
| Analyzing Voltage Transients Under Different Stimulation Configurations and Rates in Rat Cortex CK Nguyen, BS Sturgill, S Negi, SF Cogan 2024 46th Annual International Conference of the IEEE Engineering in …, 2024 | | 2024 |
| Leakage Current Measurements of Amorphous Silicon Carbide Encapsulation for Implantable Microelectrode Arrays CK Nguyen, A Joshi-Imre, S Negi, SF Cogan 2024 46th Annual International Conference of the IEEE Engineering in …, 2024 | | 2024 |
| Electrical Stability of Amorphous Silicon Carbide Encapsulation for Neural Stimulation CK Nguyen, M Bhatt, S Negi, SF Cogan BMES Meeting 2023, 2023 | | 2023 |
| Accelerated Testing of Thin-film Dielectric Encapsulation for Bioelectrical Interfaces CK Nguyen, B Batt, N Geramifard, Y Wu, SF Cogan BMES Meeting 2022, 2022 | | 2022 |
Stuart CoganUniversity of Texas at Dallas在 utdallas.edu 的电子邮件经过验证
