| A bio-enabled maximally mild layer-by-layer Kapton surface modification approach for the fabrication of all-inkjet-printed flexible electronic devices Y Fang, JGD Hester, W Su, JH Chow, SK Sitaraman, MM Tentzeris Scientific reports 6 (1), 39909, 2016 | 41 | 2016 |
| Study of intermetallic growth and kinetics in fine-pitch lead-free solder bumps for next-generation flip-chip assemblies Y Tian, J Chow, X Liu, YP Wu, SK Sitaraman Journal of electronic materials 42, 230-239, 2013 | 36 | 2013 |
| Twist Testing for Flexible Electronics JH Chow, J Meth, SK Sitaraman 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 785-791, 2019 | 22 | 2019 |
| Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies Y Tian, X Liu, J Chow, YP Wu, SK Sitaraman Microelectronics Reliability 54 (5), 939-944, 2014 | 21 | 2014 |
| Study of Wearables with Embedded Electronics Through Experiments and Simulations JH Chow, SK Sitaraman, C May, J May 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 814-821, 2018 | 20 | 2018 |
| Comparison of Sn-Ag-Cu solder alloy intermetallic compound growth under different thermal excursions for fine-pitch flip-chip assemblies Y Tian, X Liu, J Chow, YP Wu, SK Sitaraman Journal of electronic materials 42, 2724-2731, 2013 | 17 | 2013 |
| Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test R Chen, JH Chow, C Taylor, J Meth, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 16 | 2020 |
| Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors R Chen, JH Chow, Y Zhou, JS Meth, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 15 | 2021 |
| Adaptive Curvature Flexure Test to Assess Flexible Electronic Systems R Chen, J Chow, C Taylor, J Meth, S Sitaraman 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 236-242, 2018 | 14 | 2018 |
| The size effect on intermetallic microstructure evolution of critical solder joints for flip chip assemblies Y Tian, J Chow, X Liu, SK Sitaraman Soldering & Surface Mount Technology 27 (4), 178-184, 2015 | 11 | 2015 |
| Effect of Dissolved Nitrogen Gas on the Density of Di-2-Ethylhexyl Sebacate: Working Fluid of the NIST Oil Ultrasonic Interferometer Manometer Pressure Standard JH Hendricks, JR Ricker, JH Chow, DA Olson NCSLI Measure 4 (2), 52-59, 2009 | 9 | 2009 |
| Electroplated Copper Nanowires as Thermal Interface Materials J Chow, SK Sitaraman 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 8 | 2016 |
| Damage Evolution of Double-Sided Copper Conductor on Multi-layer Flexible Substrate Under Bending R Chen, J Chow, SK Sitaraman 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 729-738, 2022 | 5 | 2022 |
| Study of wearables with embedded electronics through experiments and simulations 2018 IEEE 68th Electronic Components and Technology Conf.(ECTC) JH Chow, SK Sitaraman, C May, J May IEEE, 2018 | 5 | 2018 |
| Comparison of IMC growth in flip-chip assemblies with 100-and 200-μm-pitch SAC305 solder joints Y Tian, X Liu, J Chow, YP Wu, SK Sitaraman 2013 IEEE 63rd Electronic Components and Technology Conference, 1005-1009, 2013 | 5 | 2013 |
| Anomalous behavior of Teflon-based helium permeation leak standards PJ Abbott, JH Chow NCSLI Measure 2 (3), 24-32, 2007 | 3 | 2007 |
| Mandrel Bend Test of Screen-Printed Silver Conductors R Chen, J Chow, Y Zhou, SK Sitaraman Journal of Electronic Packaging 145 (3), 031004, 2023 | 2 | 2023 |
| A Monobit Built-In Test and Diagnostic System for Flexible Electronic Interconnect JY Lei, T Moon, J Chow, SK Sitaraman, A Chatterjee 2018 IEEE 27th Asian Test Symposium (ATS), 191-196, 2018 | 1 | 2018 |
| Experimental and Modeling Study of RF Performance of a Screen-Printed Coplanar Waveguide (CPW) up to 20 GHz under Monotonic Stretching Y Zhou, JH Chow, MM Tentzeris, SK Sitaraman IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch JH Chow, SK Sitaraman Journal of Electronic Packaging 145 (4), 2023 | | 2023 |
