| Towards Fast Computation of Certified Robustness for ReLU Networks TW Weng, H Zhang, H Chen, Z Song, CJ Hsieh, D Boning, IS Dhillong, ... International Conference on Machine Learning (ICML) PMLR 80, 5276-5285, 2018 | 789 | 2018 |
| Towards stable and efficient training of verifiably robust neural networks H Zhang, H Chen, C Xiao, S Gowal, R Stanforth, B Li, D Boning, CJ Hsieh arXiv preprint arXiv:1906.06316, 2019 | 346 | 2019 |
| Design for manufacturability and statistical design: a constructive approach M Orshansky, S Nassif, D Boning Springer Science & Business Media, 2007 | 313 | 2007 |
| Analysis and decomposition of spatial variation in integrated circuit processes and devices BE Stine, DS Boning, JE Chung IEEE Transactions on Semiconductor Manufacturing 10 (1), 24-41, 1997 | 304 | 1997 |
| Robust deep reinforcement learning against adversarial perturbations on state observations H Zhang, H Chen, C Xiao, B Li, M Liu, D Boning, CJ Hsieh Advances in Neural Information Processing Systems 33, 21024-21037, 2020 | 283 | 2020 |
| Models of process variations in device and interconnect DS Boning, S Nassif Design of High Performance Microprocessor Circuits, 98-115, 2000 | 259 | 2000 |
| The physical and electrical effects of metal-fill patterning practices for oxide chemical-mechanical polishing processes BE Stine, DS Boning, JE Chung, L Camilletti, F Kruppa, ER Equi, W Loh, ... IEEE Transactions on Electron Devices 45 (3), 665-679, 1998 | 255 | 1998 |
| Run by run control of chemical-mechanical polishing DS Boning, WP Moyne, TH Smith, J Moyne, R Telfeyan, A Hurwitz, ... IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1996 | 216 | 1996 |
| Characterization and Modeling of Oxide Chemical-Mechanical Polishing Using Planarization Length and Pattern Density Concepts DO Ouma, DS Boning, JE Chung, WG Easter, V Saxena, S Misra, ... IEEE Transactions on Semiconductor Manufacturing 15 (2), 232-244, 2002 | 176 | 2002 |
| Rapid characterization and modeling of pattern-dependent variation in chemical-mechanical polishing BE Stine, DO Ouma, RR Divecha, DS Boning, JE Chung, DL Hetherington, ... Semiconductor Manufacturing, IEEE Transactions on 11 (1), 129-140, 1998 | 170 | 1998 |
| A methodology for modeling the effects of systematic within-die interconnect and device variation on circuit performance V Mehrotra, SL Sam, D Boning, A Chandrakasan, R Vallishayee, S Nassif Proceedings of the 37th Annual Design Automation Conference, 172-175, 2000 | 167 | 2000 |
| The limitations of adversarial training and the blind-spot attack H Zhang, H Chen, Z Song, D Boning, IS Dhillon, CJ Hsieh arXiv preprint arXiv:1901.04684, 2019 | 163 | 2019 |
| Robust reinforcement learning on state observations with learned optimal adversary H Zhang, H Chen, D Boning, CJ Hsieh arXiv preprint arXiv:2101.08452, 2021 | 157 | 2021 |
| A closed-form analytic model for ILD thickness variation in CMP processes B Stine, D Ouma, R Divecha, D Boning, J Chung, DL Hetherington, I Ali, ... Chemical-Mechanical Planarization for ULSI Multilevel Interconnect Confer …, 1997 | 145 | 1997 |
| Robust decision trees against adversarial examples H Chen, H Zhang, D Boning, CJ Hsieh International Conference on Machine Learning, 1122-1131, 2019 | 139 | 2019 |
| A self-tuning EWMA controller utilizing artificial neural network function approximation techniques TH Smith, DS Boning IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997 | 139 | 1997 |
| DOE/Opt: A system for design of experiments, response surface modeling, and optimization using process and device simulation DS Boning, PK Mozumder IEEE Transactions on Semiconductor Manufacturing 7 (2), 233-244, 1994 | 127 | 1994 |
| Modeling the effects of manufacturing variation on high-speed microprocessor interconnect performance V Mehrotra, S Nassif, D Boning, J Chung International Electron Devices Meeting 1998. Technical Digest (Cat. No …, 1998 | 115 | 1998 |
| An integrated characterization and modeling methodology for CMP dielectric planarization D Ouma, D Boning, J Chung, G Shin, L Olsen, J Clark Proceedings of the IEEE 1998 International Interconnect Technology …, 1998 | 113 | 1998 |
| Robustness verification of tree-based models H Chen, H Zhang, S Si, Y Li, D Boning, CJ Hsieh Advances in Neural Information Processing Systems 32, 2019 | 100 | 2019 |
