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| Stacked microelectronic assembly and method therefor Y Kim, B Haba, V Solberg US Patent 6,699,730, 2004 | 323 | 2004 |
| Reconstituted wafer level stacking B Haba, I Mohammed, V Oganesian, D Ovrutsky, LW Mirkarimi US Patent 7,901,989, 2011 | 267 | 2011 |
| Microelectronic elements with post-assembly planarization V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia US Patent 8,847,376, 2014 | 256 | 2014 |
| Microelectronic packages and methods therefor B Haba, M Beroz, TG Kang, Y Kubota, S Krishnan, JB Riley III, ... US Patent 7,453,157, 2008 | 247 | 2008 |
| Structure and method of making capped chips having vertical interconnects G Humpston, D Tuckerman, B McWilliams, B Haba, C Mitchell US Patent App. 10/949,674, 2005 | 208 | 2005 |
| Chips having rear contacts connected by through vias to front contacts B Haba, KA Honer, DB Tuckerman, V Oganesian US Patent 8,405,196, 2013 | 207 | 2013 |
| Microelectronic packages and methods therefor B Haba, TG Kang, I Mohammed, E Chau US Patent 8,058,101, 2011 | 205 | 2011 |
| Microelectronic elements with rear contacts connected with via first or via middle structures V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,796,135, 2014 | 194 | 2014 |
| Microelectronic elements having metallic pads overlying vias V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia US Patent 8,791,575, 2014 | 192 | 2014 |
| Redistributed bond pads in stacked integrated circuit die package B Haba, DV Perino, S Khalili US Patent 6,376,904, 2002 | 187 | 2002 |
| High-frequency chip packages M Warner, L Smith, B Haba, G Urbish, M Beroz, TG Kang US Patent 7,268,426, 2007 | 186 | 2007 |
| Flexible lead structures and methods of making same JW Smith, B Haba US Patent 6,117,694, 2000 | 186 | 2000 |
| Microelectronic package comprising offset conductive posts on compliant layer B Haba, M Beroz, G Humpston, JM Park US Patent 8,207,604, 2012 | 184 | 2012 |
| Formation of circuitry with modification of feature height B Haba, M Beroz, YG Kim, DB Tuckerman US Patent 7,462,936, 2008 | 179 | 2008 |
| Package-on-package assembly with wire bonds to encapsulation surface H Sato, TG Kang, B Haba, PR Osborn, WS Wang, E Chau, I Mohammed, ... US Patent 8,618,659, 2013 | 175 | 2013 |
| Microelectronic packages and methods therefor B Haba, M Beroz, R Green, I Mohammed, SE Wilson, W Zohni, Y Kubota, ... US Patent 7,176,043, 2007 | 172 | 2007 |
| Wafer-level fabrication of lidded chips with electrodeposited dielectric coating V Oganesian, D Ovrutsky, C Rosenstein, B Haba, G Humpston US Patent 7,935,568, 2011 | 165 | 2011 |
| Direct-connect integrated circuit signaling system for bypassing intra-substrate printed circuit signal paths JC Fjelstad, PK Segaram, B Haba US Patent 7,307,293, 2007 | 161 | 2007 |
| Redistributed bond pads in stacked integrated circuit die package B Haba, DV Perino, S Khalili US Patent 6,514,794, 2003 | 158 | 2003 |
Ilyas MohammedFounder, Innoor在 innoor.com 的电子邮件经过验证
