| Total-Ionizing-Dose Effects and Low-Frequency Noise in 30-nm Gate-Length Bulk and SOI FinFETs With SiO2/HfO2 Gate Dielectrics M Gorchichko, Y Cao, EX Zhang, D Yan, H Gong, SE Zhao, P Wang, ... IEEE Transactions on Nuclear Science 67 (1), 245-252, 2019 | 44 | 2019 |
| Total-Ionizing-Dose Effects and Low-Frequency Noise in 16-nm InGaAs FinFETs With HfO2/Al2O3 Dielectrics S Bonaldo, SE Zhao, A O’Hara, M Gorchichko, EX Zhang, S Gerardin, ... IEEE Transactions on Nuclear Science 67 (1), 210-220, 2019 | 38 | 2019 |
| Total-Ionizing-Dose Response of Highly-Scaled Gate-All-Around Si Nanowire CMOS Transistors M Gorchichko, EX Zhang, P Wang, S Bonaldo, RD Schrimpf, RA Reed, ... IEEE Transactions on Nuclear Science (Early Access), 2021 | 23 | 2021 |
| Total ionizing dose responses of 22-nm FDSOI and 14-nm bulk FinFET charge-trap transistors RM Brewer, EX Zhang, M Gorchichko, PF Wang, J Cox, SL Moran, ... IEEE Transactions on Nuclear Science 68 (5), 677-686, 2021 | 23 | 2021 |
| Total-ionizing-dose effects on 3D sequentially integrated, fully depleted silicon-on-insulator MOSFETs S Toguchi, EX Zhang, M Gorchichko, DM Fleetwood, RD Schrimpf, ... IEEE Electron Device Letters 41 (4), 637-640, 2020 | 17 | 2020 |
| 3-D full-band Monte Carlo simulation of hot-electron energy distributions in gate-all-around Si nanowire MOSFETs M Reaz, AM Tonigan, K Li, MB Smith, MW Rony, M Gorchichko, A O’Hara, ... IEEE Transactions on Electron Devices 68 (5), 2556-2563, 2021 | 16 | 2021 |
| TID effects in highly scaled gate-all-around Si nanowire CMOS transistors irradiated to ultrahigh doses S Bonaldo, M Gorchichko, EX Zhang, T Ma, S Mattiazzo, M Bagatin, ... IEEE Transactions on Nuclear Science 69 (7), 1444-1452, 2022 | 15 | 2022 |
| Aggressive pitch scaling (sub-0.5 μm) of W2W hybrid bonding through process innovations T Sherwood, R Patlolla, J Salfelder, T Kasbauer, R Sreenivasan, K Li, ... 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 13-18, 2023 | 13 | 2023 |
| Impacts of through-silicon vias on total-ionizing-dose effects and low-frequency noise in FinFETs K Li, EX Zhang, M Gorchichko, PF Wang, M Reaz, SE Zhao, G Hiblot, ... IEEE Transactions on Nuclear Science 68 (5), 740-747, 2021 | 12 | 2021 |
| Aging effects and latent interface-trap buildup in MOS transistors J Ding, EX Zhang, K Li, X Luo, M Gorchichko, DM Fleetwood IEEE Transactions on Nuclear Science 68 (12), 2724-2735, 2021 | 10 | 2021 |
| Total-ionizing-dose response of SiGe HBTs at elevated temperatures D Nergui, JW Teng, M Hosseinzadeh, Y Mensah, K Li, M Gorchichko, ... IEEE Transactions on Nuclear Science 69 (5), 1079-1084, 2022 | 7 | 2022 |
| Compact modeling of soft error rate in space environment VS Anashin, AE Koziukov, ME Gorchichko, KS Zemtsov, AM Galimov, ... 2016 16th European Conference on Radiation and Its Effects on Components and …, 2016 | 7 | 2016 |
| Defect and impurity-center activation and passivation in irradiated AlGaN/GaN HEMTs X Li, PF Wang, X Zhao, H Qiu, M Gorchichko, MW McCurdy, RD Schrimpf, ... IEEE Transactions on Nuclear Science, 2023 | 4 | 2023 |
| Low-frequency and random telegraph noise in 14-nm bulk si charge-trap transistors M Gorchichko, EX Zhang, M Reaz, K Li, PF Wang, J Cao, RM Brewer, ... IEEE Transactions on Electron Devices 70 (6), 3215-3222, 2023 | 2 | 2023 |
| Low-Frequency Noise and Border Traps in Irradiated nMOS and pMOS Bulk Si FinFETs With SiO2/HfO2 Gate Dielectrics K Li, X Luo, MW Rony, M Gorchichko, G Hiblot, S Van Huylenbroeck, ... IEEE Transactions on Nuclear Science 70 (4), 442-448, 2023 | 2 | 2023 |
| Response of Integrated Silicon Microwave pin Diodes to X-Ray and Fast-Neutron Irradiation JW Teng, D Nergui, H Parameswaran, NE Sepúlveda-Ramos, ... IEEE Transactions on Nuclear Science 69 (3), 282-289, 2021 | 1 | 2021 |
| Разработка SPICE-моделей комплементарных биполярных транзисторов с учетом дозового воздействия ЮЮ Гулин, АН Рябев, МЕ Горчичко Ракетно-космическое приборостроение и информационные системы 3 (4), 89-97, 2016 | 1 | 2016 |
| 300 nm Pitch W2W HBI for CFET and 3D DRAM Through Module Co-optimization T Sherwood, R Patlolla, D McIntyre, T Sekine, R Sreenivasan, Y Jeon, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 1968-1972, 2024 | | 2024 |
| Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5 um Pitch M Gorchichko, S Sharma, B Ng, T Sherwood, Y Jeon, D Mcintyre, K Li, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 404-407, 2024 | | 2024 |
| Impact of recombination on heavy ion induced single event upset cross-section KS Zemtsov, AM Galimov, ME Gorchichko, IV Elushov IOP Conference Series: Materials Science and Engineering 151 (1), 012040, 2016 | | 2016 |
