Dual-phase high-entropy ultra-high temperature ceramics M Qin, J Gild, C Hu, H Wang, MSB Hoque, JL Braun, TJ Harrington, ... Journal of the European Ceramic Society 40 (15), 5037-5050, 2020 | 115 | 2020 |
Electrical and hydrogen reduction enhances kinetics in doped zirconia and ceria: I. grain growth study Y Dong, H Wang, IW Chen Journal of the American Ceramic Society 100 (3), 876-886, 2017 | 108 | 2017 |
Dissolving and stabilizing soft WB2 and MoB2 phases into high-entropy borides via boron-metals reactive sintering to attain higher hardness M Qin, J Gild, H Wang, T Harrington, KS Vecchio, J Luo Journal of the European Ceramic Society 40 (12), 4348-4353, 2020 | 84 | 2020 |
High-entropy monoborides: Towards superhard materials M Qin, Q Yan, H Wang, C Hu, KS Vecchio, J Luo Scripta Materialia 189, 101-105, 2020 | 70 | 2020 |
Strong and ductile FeNiCoAl-based high-entropy alloys for cryogenic to elevated temperature multifunctional applications C Zhang, Q Yu, YT Tang, M Xu, H Wang, C Zhu, J Ell, S Zhao, ... Acta Materialia 242, 118449, 2023 | 65 | 2023 |
Multifunctional non‐equiatomic high entropy alloys with superelastic, high damping, and excellent cryogenic properties C Zhang, C Zhu, T Harrington, L Casalena, H Wang, S Shin, KS Vecchio Advanced Engineering Materials 21 (1), 1800941, 2019 | 62 | 2019 |
High-entropy rare earth tetraborides M Qin, Q Yan, H Wang, KS Vecchio, J Luo Journal of the European Ceramic Society 41 (4), 2968-2973, 2021 | 40 | 2021 |
Electromigration effect in Fe-Al diffusion couples with field-assisted sintering H Wang, R Kou, T Harrington, KS Vecchio Acta Materialia 186, 631-643, 2020 | 40 | 2020 |
Design, fabrication and characterization of FeAl-based metallic-intermetallic laminate (MIL) composites H Wang, T Harrington, C Zhu, KS Vecchio Acta Materialia 175, 445-456, 2019 | 37 | 2019 |
Strong and ductile refractory high-entropy alloys with super formability C Zhang, H Wang, X Wang, YT Tang, Q Yu, C Zhu, M Xu, S Zhao, R Kou, ... Acta Materialia 245, 118602, 2023 | 35 | 2023 |
Cold-workable refractory complex concentrated alloys with tunable microstructure and good room-temperature tensile behavior C Zhang, BE MacDonald, F Guo, H Wang, C Zhu, X Liu, Y Kang, X Xie, ... Scripta Materialia 188, 16-20, 2020 | 35 | 2020 |
Bulk high-entropy hexaborides M Qin, Q Yan, Y Liu, H Wang, C Wang, T Lei, KS Vecchio, HL Xin, ... Journal of the European Ceramic Society 41 (12), 5775-5781, 2021 | 33 | 2021 |
The effect of complexing agents on the oriented growth of electrodeposited microcrystalline cuprous oxide film Z Zhang, W Hu, Y Deng, C Zhong, H Wang, Y Wu, L Liu Materials Research Bulletin 47 (9), 2561-2565, 2012 | 27 | 2012 |
Deformation and fracture evolution of FeAl-based metallic-intermetallic laminate (MIL) composites H Wang, C Zhu, KS Vecchio Acta Materialia 194, 496-515, 2020 | 26 | 2020 |
Phase mapping in EBSD using convolutional neural networks K Kaufmann, C Zhu, AS Rosengarten, D Maryanovsky, H Wang, ... Microscopy and Microanalysis 26 (3), 458-468, 2020 | 25 | 2020 |
Mesoscale hetero-deformation induced (HDI) stress in FeAl-based metallic-intermetallic laminate (MIL) composites H Wang, R Kou, H Yi, S Figueroa, KS Vecchio Acta Materialia 213, 116949, 2021 | 21 | 2021 |
Microstructure evolution in Ni and Ni-superalloy based metallic-intermetallic laminate (MIL) composites Y Wang, H Wang, X Liu, KS Vecchio Intermetallics 87, 70-80, 2017 | 21 | 2017 |
Microstructure evolution in pure Ni and Invar-based Metallic-Intermetallic Laminate (MIL) composites Y Wang, H Wang, X Liu, KS Vecchio Materials Science and Engineering: A 682, 454-465, 2017 | 20 | 2017 |
Directed energy deposition of pure copper using blue laser X Liu, H Wang, K Kaufmann, K Vecchio Journal of Manufacturing Processes 85, 314-322, 2023 | 17 | 2023 |
Processing-dependent stabilization of a dissimilar rare-earth boride in high-entropy (Ti0. 2Zr0. 2Hf0. 2Ta0. 2Er0. 2) B2 with enhanced hardness and grain boundary segregation M Qin, S Shivakumar, T Lei, J Gild, EC Hessong, H Wang, KS Vecchio, ... Journal of the European Ceramic Society 42 (12), 5164-5171, 2022 | 16 | 2022 |