| Polishing process of 4H-SiC under different pressures in a water environment Y Zhou, Y Huang, J Li, W Lv, F Zhu Diamond and Related Materials 133, 109710, 2023 | 17 | 2023 |
| Coalescence behavior of Cu nanoparticles during sintering: Based on atomic scale to macro scale J Liu, W Lv, Y Mou, C Chen, Y Kang Journal of Materials Research and Technology 27, 2490-2507, 2023 | 13 | 2023 |
| Fabrication and sintering behavior of nano Cu–Ag composite paste for high-power device W Lv, J Liu, Y Mou, Y Ding, M Chen, F Zhu IEEE Transactions on Electron Devices 70 (6), 3202-3207, 2023 | 12 | 2023 |
| Porosity effect on the mechanical properties of nano-silver solder W Lv, J Hu, J Liu, C Xiong, F Zhu Nanotechnology 34 (16), 165701, 2023 | 11 | 2023 |
| Porosity dependence of thermal and electrical properties in nano-silver paste W Lv, J Liu, X Lei, F Zhu IEEE Transactions on Electron Devices 70 (2), 702-707, 2022 | 11 | 2022 |
| Investigation of the chemical action mechanism based on reactive force field in SiC chemical–mechanical polishing process Y Zhou, Y Huang, J Li, W Lv, F Zhu Applied Surface Science 646, 158927, 2024 | 7 | 2024 |
| Atomic insight in fusion mechanism of heterogeneous and homogeneous sintering: Cu and Ag nanoparticles J Liu, W Lv, C Chen, Y Kang Results in Physics 57, 107411, 2024 | 6 | 2024 |
| Atomic scale investigation of notch evolution on 4H-SiC under different cutting surfaces and environments Y Zhou, Y Huang, J Li, W Lv, F Zhu Journal of Manufacturing Processes 105, 99-111, 2023 | 6 | 2023 |
| Optimized super-resolution promote accuracy for projection speckle three-dimensional digital image correlation Y Gao, C Xiong, X Lei, Y Huang, W Lv, F Zhu Measurement Science and Technology 34 (11), 115601, 2023 | 6 | 2023 |
| Convolutional neural network with attention module for identification of tunnel seepage Q Chen, C Xiong, W Lv, B Shen, B Zeng, J Li, C Feng, Z Hu, F Zhu Transportation Research Record 2676 (11), 112-123, 2022 | 5 | 2022 |
| The effects of abrasive moving speed and motion mode on the thinning mechanism of SiC in three-body contact Y Zhou, Y Huang, J Li, W Lv, F Zhu Physica Scripta 98 (11), 115403, 2023 | 4 | 2023 |
| A full-field warpage characterization measurement method coupled with infrared information B Zeng, Y Gao, C Xiong, X Lei, W Lv, F Zhu Microelectronics Reliability 149, 115237, 2023 | 4 | 2023 |
| Design and optimization of a novel MEMS tuning fork gyroscope microstructure C Xiong, P Zeng, W Lv, F Lu, M Zhang, Y Huang, F Zhu Micromachines 13 (2), 172, 2022 | 4 | 2022 |
| Sn-enhanced high-temperature reliability of Cu/Nano-Ag/Cu joint via transient-liquid-phase bonding J Liu, W Lv, Y Mou, Y Peng, F Zhu, M Chen Journal of Materials Science 58 (26), 10870-10884, 2023 | 3 | 2023 |
| Investigation of the tribological behaviors for 4H–SiC substrate under different lubrication conditions Y Zhou, K Xu, W Lv, Y Gao, F Zhu Wear 556, 205537, 2024 | 2 | 2024 |
| The Effect of Filler Mass Fraction on The Physical Properties of Conductive Silver Adhesives Z Yu, W Lv, F Zhu 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 459-463, 2023 | 2 | 2023 |
| The effect of porosity on thermal properties of nano-silver solder for electronic packaging W Lv, J Hu, F Zhu 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC), 926-929, 2022 | 2 | 2022 |
| Atomistic simulations of the thinning process of tantalum/copper heterostructure in wafer containing through silicon via K Xu, Y Zhou, Z Yu, Y Gao, Y Chen, X Lei, C Xiong, W Lv, F Zhu Applied Surface Science 676, 161026, 2024 | 1 | 2024 |
| Electrical contact reliability investigation of high-speed electrical connectors under fretting wear behavior X Lei, C Feng, W Lv, Y Zhou, C Xiong, Y Gao, F Zhu Microelectronics Reliability 162, 115510, 2024 | 1 | 2024 |
| Role of graphene surface coating of DBC substrate on sintering motion behavior of copper nanoparticles for silicon carbide power devices J Liu, W Lv, S Wei, S Zhao The European Physical Journal Plus 139 (4), 360, 2024 | 1 | 2024 |
