| Disease detection in apple leaves using deep convolutional neural network P Bansal, R Kumar, S Kumar Agriculture 11 (7), 617, 2021 | 140 | 2021 |
| Knowledge-based neural networks for fast design space exploration of hybrid copper-graphene on-chip interconnect networks R Kumar, SSL Narayan, S Kumar, S Roy, BK Kaushik, R Achar, R Sharma IEEE Transactions on Electromagnetic Compatibility 64 (1), 182-195, 2021 | 31 | 2021 |
| Analytical model for resistivity and mean free path in on-chip interconnects with rough surfaces S Kumar, R Sharma IEEE Transactions on Emerging Topics in Computing 6 (2), 233-243, 2016 | 25 | 2016 |
| Analytical modeling and performance benchmarking of on-chip interconnects with rough surfaces S Kumar, R Sharma IEEE Transactions on Multi-Scale Computing Systems 4 (3), 272-284, 2017 | 24 | 2017 |
| A survey on layer-wise security attacks in IoT: Attacks, countermeasures, and open-issues G Sharma, S Vidalis, N Anand, C Menon, S Kumar Electronics 10 (19), 2365, 2021 | 19 | 2021 |
| High-speed interconnects: history, evolution, and the road ahead VR Kumbhare, R Kumar, MK Majumder, S Kumar, PP Paltani, BK Kaushik, ... IEEE Microwave Magazine 23 (8), 66-82, 2022 | 16 | 2022 |
| Analysis and implementation of threat agents profiles in semi-automated manner for a network traffic in real-time information environment G Sharma, S Vidalis, C Menon, N Anand, S Kumar Electronics 10 (15), 1849, 2021 | 12 | 2021 |
| Chip-to-chip copper interconnects with rough surfaces: analytical models for parameter extraction and performance evaluation S Kumar, R Sharma IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (2 …, 2017 | 11 | 2017 |
| Disease Predictor Using Random Forest Classifier S Paul, P Ranjan, S Kumar, A Kumar 2022 International Conference for Advancement in Technology (ICONAT), 1-4, 2022 | 9 | 2022 |
| Role of grain size on the effective resistivity of cu-graphene hybrid interconnects R Kumar, S Pathania, S Guglani, A Kumar, S Kumar, S Roy, BK Kaushik, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1620-1625, 2020 | 9 | 2020 |
| Analyzing crosstalk-induced effects in rough on-chip copper interconnects S Pathania, S Kumar, R Sharma IEEE Transactions on Components, Packaging and Manufacturing Technology 9 …, 2019 | 9 | 2019 |
| A temperature and dielectric roughness-aware matrix rational approximation model for the reliability assessment of copper–graphene hybrid on-chip interconnects R Kumar, A Kumar, S Guglani, S Kumar, S Roy, BK Kaushik, R Sharma, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 8 | 2020 |
| Design of low power, high gain lna for wcdma range and parameters extraction using artificial neural network (ANN) S Kumar, S Kumari 2015 IEEE Power, Communication and Information Technology Conference (PCITC …, 2015 | 8 | 2015 |
| Analytical model for inverter design using floating gate graphene field effect transistors AK Nishad, A Dalakoti, A Jindal, R Kumar, S Kumar, R Sharma 2014 IEEE Computer Society Annual Symposium on VLSI, 148-153, 2014 | 8 | 2014 |
| Design space exploration of nanoscale interconnects with rough surfaces S Kumar, R Sharma 2015 IEEE electrical design of advanced packaging and systems symposium …, 2015 | 7 | 2015 |
| Fraud Detection on Bank Payments Using Machine Learning P Ranjan, K Santhosh, A Kumar, S Kumar 2022 International Conference for Advancement in Technology (ICONAT), 1-4, 2022 | 6 | 2022 |
| Songs recommendation using context-based semantic similarity between lyrics V Gupta, S Jeevaraj, S Kumar 2021 IEEE India Council International Subsections Conference (INDISCON), 1-6, 2021 | 6 | 2021 |
| Temperature and dielectric surface roughness dependent performance analysis of Cu-graphene hybrid interconnects R Kumar, B Kumari, S Kumar, M Sahoo, R Sharma 2020 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2020 | 6 | 2020 |
| Crosstalk analysis for rough copper interconnects considering ternary logic S Pathania, S Kumar, R Sharma 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2018 | 6 | 2018 |
| Design space exploration of Through Silicon Vias for high-speed, low loss vertical links S Kumar, S Kaur, M Bakshi, M Bansal, M Choudhary, R Sharma 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS …, 2014 | 6 | 2014 |
