| Synergistic effects of Micro-hBN and core-shell Nano-TiO2@SiO2 on thermal and electrical properties of epoxy at high frequencies and temperatures M Awais, X Chen, Z Hong, Q Wang, Y Shi, FB Meng, C Dai, A Paramane Composites Science and Technology 227, 2022 | 25 | 2022 |
| Charge dynamics and thermal properties of epoxy based micro and nano hybrid composites at high temperatures X Chen, C Dai, Z Hong, M Awais, A Paramane, Y Tanaka Journal of Applied Polymer Science 138 (28), 50676, 2021 | 25 | 2021 |
| Investigating optimal region for thermal and electrical properties of epoxy nanocomposites under high frequencies and temperatures M Awais, X Chen, C Dai, W Qilong, FB Meng, H Zelin, A Paramane, ... Nanotechnology 33 (13), 135705, 2022 | 19 | 2022 |
| Tuning Epoxy for Medium Frequency Transformer Application: Resin Optimization and Characterization of Nanocomposites at High Temperature M Awais, X Chen, C Dai, FB Meng, A Paramane, Y Tanaka IEEE Transactions on Dielectrics and Electrical Insulation 28 (5), 1751-1758, 2021 | 18 | 2021 |
| Nanophotonics: Fundamentals, Challenges, Future Prospects and Applied Applications MA Iqbal, N Ashraf, W Shahid, M Awais, AK Durrani, K Shahzad, M Ikram IntechOpen, 2021 | 18 | 2021 |
| Interfacial microstructure and insulation properties of 500 kV EHVDC XLPE cable factory joint under different roughness and degassing durations FB Meng, X Chen, C Dai, M Zhang, Y Shi, A Paramane, M Awais Polymer Degradation and Stability 192, 109688, 2021 | 17 | 2021 |
| Enhancement of Insulation Properties of Cross-Linked Polyethylene Utilizing Aromatic Voltage Stabilizers with Electron-Withdrawing and Electron-Donating Groups Y Shi, X Chen, FB Meng, Z Hong, M Awais, A Paramane ACS Applied Polymer Materials 4 (2), 1422–1430, 2022 | 15 | 2022 |
| Investigation on optimal filler loadings for dielectric strength enhancement of epoxy/TiO2@ SiO2 nanocomposite M Awais, R Sundararajan, IA Sajjad, SS Haroon, S Amin, H Shaukat, ... Materials Research Express 6 (6), 065709, 2019 | 15 | 2019 |
| Potential of Epoxy Nanocomposites for Packaging Materials of High Voltage Power Modules: A Validation Using Experiments and Simulation X Chen, Q Wang, N Ren, C Dai, M Awais, A Paramane IEEE Transactions on Dielectrics and Electrical Insulation 28 (6), 2161 - 2169, 2021 | 14 | 2021 |
| Spraying EPDM@NPs as an Efficient Strategy for Polyethylene-Based High-Voltage Insulation M Fan-Bo, C Xiangrong, S Yiwen, H Zelin, Z Hanshan, M Awais, L Hao, ... Chemical Engineering Journal 451 (3), 2022 | 13* | 2022 |
| Effect of Dopamine-Functionalized Nano-h-BN on the Charge Dynamics and Thermal Properties of Epoxy Resins at High Temperatures for Potential Power Module Encapsulation Application C Dai, Y Tanaka, M Awais, X Chen, A Paramane ACS Applied Electronic Materials 3 (12), 5345–5354, 2021 | 13 | 2021 |
| Electrical and thermal performances of epoxy-based micro–nano hybrid composites at different electric fields and temperatures C Dai, X Chen, Q Wang, M Awais, G Zhu, Y Shi, A Paramane, Y Tanaka Nanotechnology 32 (31), 315715, 2021 | 13 | 2021 |
| A Review on Insulation and Dielectrics for High Temperature Superconducting Cables for Power Distribution: Progress, Challenges, and Prospects A Paramane, M Awais, T Chandrasekaran, M Junaid, MT Nazir, X Chen IEEE Transactions on Applied Superconductivity 33 (6), 2023 | 11 | 2023 |
| Effect of regular and core shell nano fillers on the partial discharge and tracking performance of low density polyethylene HA Awan, S Amin, T ur Rahman, U Asad, M Awais Materials Research Express 7 (1), 015062, 2020 | 11 | 2020 |
| Temperature-Dependent Charge Dynamics of Double Layer Interface in 500 kV HVDC XLPE Cable Factory Joint with Different Interfacial Roughness M Fan-Bo, C Xiangrong, S Yiwen, Z Hanshan, H Zelin, M Awais, P Ashish, ... IEEE Transactions on Dielectrics and Electrical Insulation 29 (2), 655-662, 2022 | 10 | 2022 |
| Tailoring Electric Field Distortion in High-Voltage Power Modules Utilizing Epoxy Resin/Silicon Carbide Whisker Composites with Field-Dependent Conductivity Q Wang, X Chen, X Huang, M Awais, Y Shi, C Dai, N Ren, A Paramane ACS Applied Electronic Materials 4 (1), 478-493, 2022 | 10 | 2022 |
| Enhancement of electrical properties by including nano-aluminum nitride to micro-silicon carbide/silicone elastomer composites for potential power module packaging applications X Chen, Q Wang, X Huang, M Awais, A Paramane, N Ren Journal of Materials Science: Materials in Electronics 33, 18768-18785, 2022 | 9 | 2022 |
| Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials X Chen, Q Wang, X Huang, M Awais, A Paramane, N Ren IEEE Transactions on Components, Packaging, and Manufacturing Technology 12 …, 2022 | 9 | 2022 |
| Experimental and Finite Element Analysis of Epoxy-based Composites for Packaging Materials to Reduce Electric Field and Power Loss Under AC and DC Conditions Q Wang, X Chen, C Dai, A Paramane, M Awais, N Ren IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 9 | 2021 |
| The tracking and erosion performance of silicone rubber incorporated with novel TiO2@ SiO2 core-shell nano fillers under the IEC 60587 standard U Asad, S Amin, MH Aziz, M Awais, T ur Rahman, HA Awan Materials Research Express 7 (2), 025006, 2020 | 8 | 2020 |
Ashish ParamaneAssistant Professor, Electrical Engineering Department, NIT Silchar, India在 ee.nits.ac.in 的电子邮件经过验证
