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Subhasis Mukherjee
Subhasis Mukherjee
IC Packaging, Apple
在 apple.com 的电子邮件经过验证
标题
引用次数
引用次数
年份
Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder
S Mukherjee, B Zhou, A Dasgupta, TR Bieler
international Journal of Plasticity 78, 1-25, 2016
562016
Creep Constitutive Models Suitable for Solder Alloys in Electronic Assemblies
S Mukherjee, M Nuhi, A Dasgupta, M Modarres
Journal of Electronic Packaging, 2016
522016
Effect of isothermal aging on microstructure and creep properties of SAC305 solder: a micromechanics approach
P Chauhan, S Mukherjee, M Osterman, A Dasgupta, M Pecht
International Electronic Packaging Technical Conference and Exhibition 55751 …, 2013
322013
Mechanistic Prediction of the Effect of Microstructural Coarsening on Creep Response of SnAgCu Solder Joints
S Mukherjee, P Chauhan, M Osterman, A Dasgupta, M Pecht
Journal of Electronic Materials, 1-14, 2016
172016
Multiscale Modeling of the Effect of Micro-alloying Mn and Sb on the Viscoplastic Response of SAC105 Solder
S Mukherjee, A Dasgupta, B Zhou, TR Bieler
Journal of Electronic Materials, 1-12, 2014
132014
Mechanistic modeling of the anisotropic steady state creep response of SnAgCu single crystal
S Mukherjee, B Zhou, A Dasgupta, TR Bieler
International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015
122015
Effect of addition of manganese and antimony on viscoplastic properties and cyclic mechanical durability of low silver Sn-Ag-Cu solder
S Mukherjee, TT Mattila, A Dasgupta
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
82012
An evaluation of a modified iosipescu specimen for measurement of elastic-plastic properties of solder materials
S Mukherjee, A Dasgupta
ASME International Mechanical Engineering Congress and Exposition 44281, 351-356, 2010
72010
Multiscale modeling of the anisotropic creep response of SnAgCu single crystal
S Mukherjee
University of Maryland, College Park, 2015
42015
Mechanical constitutive properties of a bi-rich high temperature solder alloy
Q Jiang, S Mukherjee, A Dasgupta, D Shaddock, L Yin
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
32016
Durability assessment of photovoltaic (PV) products under environmental thermal cycling
J Akman, C Choi, S Mukherjee, J Meng, E Mirbagheri, G Haddad, D Das, ...
13th InterSociety Conference on Thermal and Thermomechanical Phenomena in …, 2012
22012
Mechanical Constitutive Properties of Two High-Temperature Lead-Rich Solders
Q Jiang, S Mukherjee, B Vogt, A Dasgupta, D Shaddock, L Yin
International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015
12015
Effect of gold and copper on microstructural evolution and mechanical durability of SAC305 solder joints
S Mukherjee, A Dasgupta, J Silk, LL Ong
2014 International Conference on Electronics Packaging (ICEP), 162-167, 2014
12014
Inhibiting the Re-Deposition of AuSn4 on Au/Ni Metallization Pads by Varying the Accessibility of Cu in Isothermally Aged SAC305 Solder Joints
S Mukherjee, A Dasgupta, J Silk, L Ong
ASME International Mechanical Engineering Congress and Exposition 56390 …, 2013
12013
Multiscale Creep modeling of the Effect of Micro-alloying Manganese into SACI05 Solder
S Mukherjeel, A Dasgupta
EuroSIME, Wroclaw, Poland, 2013
12013
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